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TDA6650ATT

NXP Semiconductors

TDA6650ATT by NXP Semiconductors

TDA6650ATT by NXP Semiconductors is a BICMOS consumer IC designed for efficient performance in compact applications. It operates at 5V with a max supply current of 136mA and features a dual gull-wing terminal design. Ideal for surface mount technology, it ensures reliable functionality in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,140 parts In-Stock

1+ parts

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1k+ parts

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4,140

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Anansix

USA . 1,699 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,699

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Digiode

USA . 576 parts In-Stock

1+ parts

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576

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,120 parts In-Stock

1+ parts

$18.800

100+ parts

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1k+ parts

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10k+ parts

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1,120

$18.800

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UNI Independent Distributors

Spain . 4,990 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,990

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Corphita

USA . 240 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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240

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Overview

Elevate your consumer electronics with the TDA6650ATT from NXP Semiconductors, a leader in innovation and quality. This versatile IC delivers exceptional performance in various applications, from audio systems to smart devices, ensuring reliability and efficiency. Its compact design and robust technology make integration seamless, providing you with the competitive edge needed in today's market. Experience enhanced functionality and peace of mind with NXP's trusted expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for consumer applications.

Surface Mount: YES

Surface mount capability allows for compact designs and improves assembly efficiency, making this IC ideal for modern electronic devices with limited space.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs and allows for easy integration into various circuit designs.

General IC Type: CONSUMER CIRCUIT

Being classified as a consumer circuit IC makes it ideal for applications in everyday electronic devices, catering to a wide market.

Power Supplies (V): 5

A 5V power supply requirement allows compatibility with common consumer electronics, enhancing ease of integration.

No. of Terminals: 38

Having 38 terminals provides diverse connectivity options, enabling the IC to handle multiple functions and interactions in complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design help save space and allow for high-density applications, perfect for portable devices.

Minimum Operating Temperature: -20 °C

A minimum operating temperature of -20 °C ensures reliability in a variety of environments, making it suitable for both indoor and outdoor applications.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and electrical performance, ensuring stable connections during operation.

Terminal Position: DUAL

The dual terminal position design enhances layout flexibility on PCBs, facilitating better design options and efficiency.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of Bipolar and CMOS, providing high speed and low power consumption, making it efficient for consumer applications.

Maximum Supply Current: 136 mA

With a maximum supply current of 136 mA, the IC provides sufficient power for demanding operations while maintaining efficiency.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for tighter spacing on PCBs, enabling more compact designs suitable for modern electronics.

Technical Specifications

Other Function Consumer ICs TDA6650ATT attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e0

No. of Terminals:

38

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

136 mA

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

TDA6650ATT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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