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CBTL08GP053EVY

NXP Semiconductors

CBTL08GP053EVY by NXP Semiconductors

NXP Semiconductors' CBTL08GP053EVY is a consumer IC with 40 terminals in a grid array package. It operates b/w -40 to 85°C, with supply voltage ranging from 2.9V to 3.6V. Ideal for industrial applications requiring fine pitch and thin profile components.

Median Price

$1.342

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 6 parts In-Stock

1+ parts

$1.322

100+ parts

-

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6

$1.322

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Chip1Stop

Japan . 16 parts In-Stock

1+ parts

$1.710

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16

$1.710

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DigiKey

USA . 13 parts In-Stock

1+ parts

$2.560

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13

$2.560

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Rochester

USA . 17,000 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.090

10k+ parts

$1.020

17,000

-

$1.220

$1.090

$1.020

Verical

USA . 17,000 parts In-Stock

1+ parts

-

100+ parts

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$1.363

10k+ parts

$1.275

17,000

-

-

$1.363

$1.275

Mouser Electronics

USA . 5,131 parts In-Stock

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$1.220

5,131

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$1.220

Distributors (In-Stock)

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Digiode

USA . 4,159 parts In-Stock

1+ parts

$1.282

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4,159

$1.282

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$2.050

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700

$2.050

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Flip Electronics

USA . 217,713 parts In-Stock

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217,713

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DigiKey Marketplace

USA . 40,000 parts In-Stock

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$1.560

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40,000

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$1.560

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Vyrian

USA . 9,764 parts In-Stock

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9,764

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Anansix

USA . 2,882 parts In-Stock

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2,882

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Distributors (Availability)

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Semicontronic

India . 9,711 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

10k+ parts

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9,711

$0.990

$0.965

$0.960

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Ampacity Inc.

Singapore . 9,592 parts In-Stock

1+ parts

$0.990

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9,592

$0.990

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Corphita

USA . 2,560 parts In-Stock

1+ parts

$1.215

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2,560

$1.215

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Continental Prestige Electronics

USA . 2,131 parts In-Stock

1+ parts

$1.570

100+ parts

$1.100

1k+ parts

$0.794

10k+ parts

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2,131

$1.570

$1.100

$0.794

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Argo Parts USA

USA . 4,370 parts In-Stock

1+ parts

$2.050

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4,370

$2.050

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Netroflash

USA . 500 parts In-Stock

1+ parts

$2.050

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500

$2.050

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Corohmni

South Africa . 340 parts In-Stock

1+ parts

$2.257

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340

$2.257

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Aztec Data Supply Inc.

USA . 138 parts In-Stock

1+ parts

$3.660

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138

$3.660

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Microchip USA

USA . 6,948 parts In-Stock

1+ parts

$8.440

100+ parts

$8.390

1k+ parts

$8.360

10k+ parts

$8.330

6,948

$8.440

$8.390

$8.360

$8.330

Lixinc

USA . 12,140 parts In-Stock

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12,140

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Perfect Parts

USA . 5,622 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,487 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,658 parts In-Stock

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3,658

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UNI Independent Distributors

Spain . 3,035 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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$78.955

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$78.955

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$78.955

300

-

$78.955

$78.955

$78.955

Overview

Experience the cutting-edge technology and superior quality of the CBTL08GP053EVY by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers innovative solutions with this consumer circuit IC. This versatile product is ideal for a wide range of applications, offering customers unmatched value, benefits, and advantages. Upgrade your electronic devices with the reliability and performance that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, making it suitable for consumer applications where reliability is important.

Surface Mount: YES

Being surface mountable makes it easier to incorporate this IC into electronic designs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards and ensures compatibility with standard board layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for efficiency, performance, and cost-effectiveness in such products.

No. of Terminals: 40

Having a high number of terminals allows for greater connectivity options and flexibility in designing circuits and connecting peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact footprint, high component density, and precision alignment, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding operating conditions and ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance even in extreme temperature conditions, enhancing the versatility of this IC.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring stable connections and reliability in use.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and soldering onto the circuit board, simplifying the assembly process.

Maximum Seated Height: 0.99 mm

The low seated height enables a slim profile design, contributing to space-saving and aesthetically pleasing consumer products.

Width: 3.25 mm

The narrow width allows for compact integration within circuit layouts and enables high-density mounting configurations for efficient use of board space.

Minimum Supply Voltage (Vsup): 2.9 V

Operating at low supply voltage levels ensures energy efficiency and battery-saving capabilities, making it suitable for portable consumer devices.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the reliability and robustness of the IC during the reflow soldering process, ensuring quality solder joints.

Peak Reflow Temperature °C: 260

The high reflow temperature capability allows for lead-free soldering and compliance with RoHS regulations, ensuring environmental friendliness.

Length: 4.75 mm

The compact length contributes to the overall small form factor of the IC, enabling space-efficient designs in consumer electronic products.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets stringent quality and performance standards, ensuring durability and reliability in harsh environments.

Terminal Form: BALL

The ball terminal form provides reliable solder joints, easy reworkability, and high mechanical strength, enhancing the overall reliability of the IC.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting of components, enabling miniaturization and increased functionality in compact consumer devices.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this IC can withstand moderate exposure to moisture during storage and handling, ensuring operational reliability in various environments.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage rating provides flexibility in power supply configurations and compatibility with a wide range of consumer electronic devices.

Technical Specifications

Other Function Consumer ICs CBTL08GP053EVY attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B40

JESD-609 Code:

e1

Length:

4.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.99 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.25 mm

Trade Compliance

CBTL08GP053EVY General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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