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CBTL08GP053EV

NXP Semiconductors

CBTL08GP053EV by NXP Semiconductors

CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 40; Package Code: VFBGA; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 217,713 parts In-Stock

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217,713

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Digiode

USA . 4,700 parts In-Stock

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4,700

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Vyrian

USA . 3,692 parts In-Stock

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3,692

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Anansix

USA . 949 parts In-Stock

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949

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Distributors (Availability)

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One Stop Electronics

USA . 1,180 parts In-Stock

1+ parts

$14.800

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1,180

$14.800

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UNI Independent Distributors

Spain . 7,888 parts In-Stock

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7,888

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Kepictronics

USA . 2,004 parts In-Stock

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2,004

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Northwest PG Solutions

USA . 1,468 parts In-Stock

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1,468

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Infinite Electronics LLP (Excess)

. 756 parts In-Stock

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756

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Formix International (Excess)

India . 754 parts In-Stock

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754

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Native Components

USA . 389 parts In-Stock

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389

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Corphita

USA . 87 parts In-Stock

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87

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Technical Specifications

Other Function Consumer ICs CBTL08GP053EV attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B40

Length:

4.75 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.99 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3.25 mm

Trade Compliance

CBTL08GP053EV General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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