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PNX1702EH/G

NXP Semiconductors

PNX1702EH/G by NXP Semiconductors

The NXP Semiconductors PNX1702EH/G is a consumer circuit IC with 456 terminals in a rectangular grid array package. It operates b/w 0°C to 85°C, with supply voltage ranging from 1.23V to 1.37V. This CMOS technology chip is designed for surface mount applications in various electronic devices.

Median Price

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Lifecycle Status

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5

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1k+

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Digiode

USA . 3,530 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 893 parts In-Stock

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Corohmni

South Africa . 1,013 parts In-Stock

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Ampacity Inc.

Singapore . 410 parts In-Stock

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AZTECH Wire

Italy . 686 parts In-Stock

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Semicontronic

India . 394 parts In-Stock

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$19.800

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$19.305

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Lixinc

USA . 14,649 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,943 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

Australia . 20 parts In-Stock

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Overview

Elevate your consumer electronic devices to the next level with the PNX1702EH/G by NXP Semiconductors. Manufactured with top-notch quality and unmatched expertise, this versatile IC offers a wide range of applications in various consumer products. Experience seamless performance, enhanced functionality, and superior reliability in a compact package, making it the perfect choice for your next project. Unlock endless possibilities and elevate your designs with the PNX1702EH/G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to environmental factors, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, reducing manufacturing costs and time.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, ensuring compatibility and performance in various consumer electronic devices.

Maximum Operating Temperature: 85 °C

Capable of operating in a wide temperature range, making it suitable for use in different environments and conditions.

Minimum Supply Voltage: 1.23 V

Low minimum supply voltage requirement enables energy-efficient operation and prolongs battery life in portable devices.

Technology: CMOS

CMOS technology offers high performance with low power consumption, making this product ideal for energy-efficient electronic devices.

Technical Specifications

Other Function Consumer ICs PNX1702EH/G attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B456

Length:

27 mm

No. of Functions:

1

No. of Terminals:

456

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

1.37 V

Minimum Supply Voltage (Vsup):

1.23 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

PNX1702EH/G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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