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PNX1302EH/G,557

NXP Semiconductors

PNX1302EH/G,557 by NXP Semiconductors

PNX1302EH/G,557 by NXP Semiconductors is a consumer IC designed for versatile applications. It features a 292-terminal grid array with bottom ball terminals and operates on power supplies of 2.5V and 3.3V. Its compact square package ensures efficient surface mounting in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,792 parts In-Stock

1+ parts

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2,792

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Anansix

USA . 1,164 parts In-Stock

1+ parts

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1,164

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Vyrian

USA . 86 parts In-Stock

1+ parts

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86

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,568 parts In-Stock

1+ parts

$9.800

100+ parts

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1,568

$9.800

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UNI Independent Distributors

Spain . 6,352 parts In-Stock

1+ parts

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6,352

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Corphita

USA . 3,787 parts In-Stock

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3,787

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Overview

Unlock the potential of your next project with the PNX1302EH/G,557 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a consumer IC that enhances performance and reliability. Ideal for diverse applications, this versatile chip offers exceptional value, enabling seamless integration and superior functionality. Experience the benefits of advanced technology that elevates your designs and drives success in the competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures excellent protection and reliability, making the product suitable for various consumer applications.

Surface Mount: YES

The surface mount capability allows for compact design and easy integration into modern electronics, saving valuable PCB space.

Package Shape: SQUARE

The square shape contributes to a balanced layout on the PCB, which may enhance thermal efficiency and signal integrity.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, this IC ensures compatibility and optimized performance in related devices.

Power Supplies: 2.5V, 3.3V

Multiple voltage supply options enhance flexibility for various applications while ensuring efficient power consumption.

No. of Terminals: 292

A higher number of terminals provides greater connectivity and functionality, enabling complex designs and advanced features.

Package Style: GRID ARRAY

The GRID ARRAY style facilitates better performance in thermal and electrical connectivity, making it ideal for high-density applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient space utilization and improved surface mount technology compatibility.

Terminal Form: BALL

Ball terminals support reliable soldering and robust connections, ensuring long-term reliability in consumer devices.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch strikes a balance between fine pitch for high-density applications and ease of manufacturing.

Technical Specifications

Other Function Consumer ICs PNX1302EH/G,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B292

No. of Terminals:

292

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA292,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trade Compliance

PNX1302EH/G,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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