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PNX1311EH/G,557

NXP Semiconductors

PNX1311EH/G,557 by NXP Semiconductors

PNX1311EH/G,557 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates on power supplies of 2.2V and 3.3V, features a 292-terminal grid array package, and has a compact ball terminal pitch of 1.27mm. Ideal for various electronic devices, it ensures efficient performance in consumer circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,964 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,964

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Digiode

USA . 4,117 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,117

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Anansix

USA . 1,115 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,115

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 430 parts In-Stock

1+ parts

$17.800

100+ parts

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1k+ parts

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10k+ parts

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430

$17.800

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UNI Independent Distributors

Spain . 7,764 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,764

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Corphita

USA . 2,181 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,181

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Overview

Elevate your designs with the PNX1311EH/G,557 from NXP Semiconductors, a trusted leader in innovative solutions. This versatile consumer IC boasts exceptional quality and reliability, making it ideal for various applications, from audio processing to smart devices. With its compact design and efficient power supply options, you can enhance performance while saving space. Experience the value of superior technology that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making this IC suitable for various consumer applications.

Surface Mount: YES

Surface mount technology provides a compact design and efficient space utilization on PCBs, making the product ideal for modern electronic devices.

Package Shape: SQUARE

A square package shape allows for uniform distribution of thermal and electrical characteristics, aiding in performance consistency.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, this IC provides optimized performance and reliability for everyday devices.

Power Supplies (V): 2.2, 3.3

Support for multiple voltage levels enhances compatibility with a wide range of consumer devices and facilitates energy-efficient designs.

No. of Terminals: 292

A high number of terminals allows for greater connectivity options and flexibility in design, accommodating complex circuit requirements.

Package Style (Meter): GRID ARRAY

The grid array package style optimizes performance for high-density applications, ensuring efficient heat dissipation and improved signal integrity.

Terminal Position: BOTTOM

Bottom-placed terminals enhance solder joint reliability and improve electrical performance, making assembly easier and more dependable.

Terminal Form: BALL

Ball terminal form provides better reliability and easier handling during surface-mount assembly, promoting a robust connection.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for fine-pitch designs, accommodating modern high-density PCB layouts while ensuring reliable performance.

Technical Specifications

Other Function Consumer ICs PNX1311EH/G,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B292

No. of Terminals:

292

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA292,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trade Compliance

PNX1311EH/G,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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