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PNX1300EH/G,557

NXP Semiconductors

PNX1300EH/G,557 by NXP Semiconductors

PNX1300EH/G,557 by NXP Semiconductors is a consumer IC designed for efficient performance. It features a 292-terminal grid array with a bottom ball terminal form and operates on power supplies of 2.5V and 3.3V. Ideal for various consumer applications, it ensures reliable surface mount integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,936 parts In-Stock

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2,936

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Vyrian

USA . 2,365 parts In-Stock

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2,365

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Anansix

USA . 681 parts In-Stock

1+ parts

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681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 626 parts In-Stock

1+ parts

$19.800

100+ parts

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626

$19.800

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UNI Independent Distributors

Spain . 5,392 parts In-Stock

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5,392

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Corphita

USA . 2,295 parts In-Stock

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2,295

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Overview

Elevate your consumer electronics with the PNX1300EH/G,557 from NXP Semiconductors—a leader in innovative solutions. This versatile IC is expertly crafted for optimal performance, offering a reliable foundation for diverse applications, from audio systems to smart devices. Experience enhanced efficiency and superior functionality that unlocks endless possibilities, ensuring you stay ahead of the competition while delivering exceptional value to your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures a robust housing, providing excellent protection against environmental factors and enhancing the longevity of the product.

Surface Mount: YES

Surface mount capability allows for compact design, facilitating higher density PCB layouts and reducing overall device size.

Package Shape: SQUARE

The square shape optimizes space efficiency on the PCB and enhances thermal management, making it ideal for high-performance applications.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, it is tailored for applications in consumer electronics, ensuring reliability and optimization for everyday use.

Power Supplies (V): 2.5, 3.3

Multiple supply voltage options (2.5V and 3.3V) offer flexibility in design and compatibility with a wide range of electronic components.

No. of Terminals: 292

A high number of terminals (292) facilitates complex interconnections and supports advanced functionalities, ideal for sophisticated electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style enables better electrical performance and easier thermal dissipation, making it suitable for high-speed applications.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes space on the PCB and allows for better routing options, especially in densely populated boards.

Terminal Form: BALL

Ball terminal form enhances solder joint reliability and improves manufacturing processes, ensuring robust connections in assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of manufacturing, making it suitable for high-density applications without compromising assembly integrity.

Technical Specifications

Other Function Consumer ICs PNX1300EH/G,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B292

No. of Terminals:

292

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA292,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trade Compliance

PNX1300EH/G,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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