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PNX1702EH/G,557

NXP Semiconductors

PNX1702EH/G,557 by NXP Semiconductors

PNX1702EH/G,557 by NXP Semiconductors is a consumer IC with 456 terminals in a rectangular grid array package. Operating temperature ranges from 0 to 85°C, with supply voltage of 1.23-1.37V. This CMOS technology chip is ideal for various consumer circuit applications requiring high performance and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Digiode

USA . 2,437 parts In-Stock

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Anansix

USA . 1,819 parts In-Stock

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Vyrian

USA . 1,504 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Bristol Electronics

USA . 20 parts In-Stock

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Atlantic Semiconductor

USA . 20 parts In-Stock

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Ampacity Inc.

Singapore . 849 parts In-Stock

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$8.800

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One Stop Electronics

USA . 1,366 parts In-Stock

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$10.800

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AZTECH Wire

Italy . 525 parts In-Stock

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Semicontronic

India . 1,137 parts In-Stock

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$14.800

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$14.430

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$14.356

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Continental Prestige Electronics

USA . 6,110 parts In-Stock

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UNI Independent Distributors

Spain . 4,750 parts In-Stock

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Corphita

USA . 2,178 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Upgrade your electronics with the PNX1702EH/G,557 from NXP Semiconductors! Known for their superior quality and cutting-edge technology, NXP Semiconductors delivers top-notch performance with this consumer IC. With a wide range of applications, this product offers unmatched value and benefits to customers. Experience the advantages of NXP Semiconductors and take your devices to the next level with the PNX1702EH/G,557.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the product suitable for portable consumer devices.

Surface Mount: YES

Surface mount technology allows for compact placement on a circuit board, saving space and improving overall design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor that is easy to integrate into various electronic designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring optimized performance and compatibility with a wide range of devices.

No. of Terminals: 456

Having a high number of terminals allows for complex circuit connections and additional functionality in the product.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance and electrical characteristics for enhanced reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environments and extended usage.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, improving manufacturing efficiency.

Maximum Seated Height: 2.45 mm

The low seated height allows for a slim profile and compact design, ideal for space-constrained applications.

Width: 27 mm

The moderate width provides a balance between space efficiency and ease of handling during assembly.

Minimum Supply Voltage (Vsup): 1.23 V

The low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes thermal stress on the components during assembly, maintaining product integrity.

Peak Reflow Temperature °C: 250

With a high peak reflow temperature, the product can withstand the soldering process without compromising performance.

Length: 27 mm

The compact length contributes to a space-saving design, ideal for densely populated circuit boards.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, enhancing overall efficiency.

Terminal Form: BALL

Ball terminal form facilitates reliable electrical connections and simplifies soldering during assembly.

Terminal Pitch: 1 mm

The fine terminal pitch allows for high-density mounting, enabling complex circuitry in a small footprint.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product can withstand moderate exposure to moisture during storage and handling.

Maximum Supply Voltage (Vsup): 1.37 V

The high maximum supply voltage provides flexibility in power input options and supports a wide range of operational conditions.

Technical Specifications

Other Function Consumer ICs PNX1702EH/G,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B456

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

456

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

1.37 V

Minimum Supply Voltage (Vsup):

1.23 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Trade Compliance

PNX1702EH/G,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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