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MC1496BDG

Onsemi

MC1496BDG by Onsemi

MC1496BDG by Onsemi is a 14-terminal IC with small outline package. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 12V and surface mount capability, it is ideal for consumer circuit designs.

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 345 parts In-Stock

1+ parts

$0.320

100+ parts

$0.310

1k+ parts

$0.310

10k+ parts

-

345

$0.320

$0.310

$0.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

-

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-

50

$0.370

-

-

-

Chip Stock

USA . 30,000 parts In-Stock

1+ parts

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30,000

-

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Vyrian

USA . 3,392 parts In-Stock

1+ parts

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3,392

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Digiode

USA . 2,166 parts In-Stock

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-

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2,166

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LWI Electronics Inc

India . 146 parts In-Stock

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146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,510 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

-

10k+ parts

$0.363

6,510

$0.370

-

-

$0.363

Argo Parts USA

USA . 314 parts In-Stock

1+ parts

$0.370

100+ parts

-

1k+ parts

-

10k+ parts

$0.359

314

$0.370

-

-

$0.359

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.429

100+ parts

$0.395

1k+ parts

$0.370

10k+ parts

-

600

$0.429

$0.395

$0.370

-

Aztec Data Supply Inc.

USA . 3,190 parts In-Stock

1+ parts

$0.993

100+ parts

-

1k+ parts

-

10k+ parts

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3,190

$0.993

-

-

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AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$14.919

100+ parts

-

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683

$14.919

-

-

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Semicontronic

India . 1,252 parts In-Stock

1+ parts

$17.800

100+ parts

$17.355

1k+ parts

$17.266

10k+ parts

-

1,252

$17.800

$17.355

$17.266

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Ampacity Inc.

Singapore . 1,222 parts In-Stock

1+ parts

$19.800

100+ parts

-

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1,222

$19.800

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Kulean Microsystems

USA . 8,034 parts In-Stock

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8,034

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TANS Electronics

Latvia . 6,709 parts In-Stock

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6,709

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Problanco Electronics

Mexico . 2,682 parts In-Stock

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2,682

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Perfect Parts

USA . 1,958 parts In-Stock

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1,958

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SupplyDigital Components

Austria . 1,634 parts In-Stock

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1,634

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Corphita

USA . 1,624 parts In-Stock

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1,624

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A-Z Elektronik GmbH

Germany . 1,292 parts In-Stock

1+ parts

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1,292

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Corohmni

South Africa . 485 parts In-Stock

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485

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UHIMA Technologies

Türkiye . 160 parts In-Stock

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160

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Bastille Electronics

Australia . 59 parts In-Stock

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59

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Overview

Experience the unmatched quality and reliability of Onsemi with the MC1496BDG, a versatile consumer IC that offers exceptional performance in a compact package. Whether you're designing audio equipment, communication systems, or automotive electronics, this product delivers outstanding results. With a wide operating temperature range, low supply voltage requirements, and easy surface mount installation, the MC1496BDG is the perfect choice for your next project. Trust Onsemi to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to handle and fit into standard circuit layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring optimal performance and reliability.

No. of Terminals: 14

Sufficient number of terminals for various connections and functionalities.

Package Style: SMALL OUTLINE

Small outline package design saves space on the PCB and allows for compact device designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme conditions without compromising functionality.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good conductivity and corrosion resistance for reliable connections.

Width: 3.9 mm

Compact width allows for space-efficient placement on the PCB.

Minimum Supply Voltage: 12 V

Designed to operate efficiently at a minimum supply voltage of 12 V, suitable for many consumer electronic applications.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the IC can withstand rigorous automotive environmental conditions.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Maximum Supply Current: 9 mA

Low maximum supply current consumption for energy-efficient operation.

Technical Specifications

Other Function Consumer ICs MC1496BDG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MC1496BDG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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