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MC1496DR2

Onsemi

MC1496DR2 by Onsemi

MC1496DR2 by Onsemi is a 14-terminal IC with a small outline package. It operates b/w 0-70°C, suitable for consumer circuits. With a supply voltage of 12V and peak reflow temp of 235°C, it's ideal for various electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 25,406 parts In-Stock

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Digiode

USA . 856 parts In-Stock

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856

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Manoshevitz Elec. Sales

Israel . 750 parts In-Stock

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750

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R&J Components

USA . 512 parts In-Stock

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512

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Vyrian

USA . 418 parts In-Stock

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Odyssey Electronics LTD

USA . 89 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,957 parts In-Stock

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$0.540

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$0.530

4,957

$0.540

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$0.530

Netroflash

USA . 500 parts In-Stock

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$0.540

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$0.530

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500

$0.540

$0.530

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Argo Parts USA

USA . 356 parts In-Stock

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$0.540

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$0.524

356

$0.540

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$0.524

Aztec Data Supply Inc.

USA . 3,407 parts In-Stock

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$1.622

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$1.622

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Ampacity Inc.

Singapore . 1,312 parts In-Stock

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$2.800

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$2.800

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AZTECH Wire

Italy . 787 parts In-Stock

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$12.524

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787

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Semicontronic

India . 1,422 parts In-Stock

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$16.800

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$16.380

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$16.296

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QUARKTWIN TECHNOLOGY LTD

USA . 24,293 parts In-Stock

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Problanco Electronics

Mexico . 5,083 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,073 parts In-Stock

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SupplyDigital Components

Austria . 3,825 parts In-Stock

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TANS Electronics

Latvia . 3,321 parts In-Stock

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Kulean Microsystems

USA . 2,188 parts In-Stock

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Corphita

USA . 1,990 parts In-Stock

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UHIMA Technologies

Türkiye . 709 parts In-Stock

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Corohmni

South Africa . 487 parts In-Stock

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487

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Overview

Elevate your consumer circuits with the MC1496DR2 by Onsemi. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Ideal for a wide range of applications, this small outline package delivers exceptional performance and efficiency. Unlock new possibilities and streamline your projects with the MC1496DR2. Trust in Onsemi's reputation for excellence and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, facilitating efficient assembly processes.

No. of Terminals: 14

Having 14 terminals provides versatility and connectivity options for various circuit configurations.

Maximum Operating Temperature: 70 °C

Operational at temperatures up to 70 °C, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

Capable of functioning at low temperatures, enabling usage in diverse environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish offers good conductivity and solderability for reliable connections.

Maximum Supply Voltage: 12 V

Supports a maximum supply voltage of 12 V, providing compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs MC1496DR2 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

MC1496DR2 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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