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PNX1301EH/G,557

NXP Semiconductors

PNX1301EH/G,557 by NXP Semiconductors

PNX1301EH/G,557 by NXP Semiconductors is a consumer IC designed for efficient performance. It features a 292-terminal grid array with a 1.27 mm pitch and operates on power supplies of 2.5V and 3.3V. Ideal for various consumer applications, it supports surface mount technology in a square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,956 parts In-Stock

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4,956

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Vyrian

USA . 2,728 parts In-Stock

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2,728

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Anansix

USA . 1,998 parts In-Stock

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1,998

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Distributors (Availability)

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One Stop Electronics

USA . 157 parts In-Stock

1+ parts

$8.800

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157

$8.800

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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Corphita

USA . 1,912 parts In-Stock

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1,912

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UNI Independent Distributors

Spain . 257 parts In-Stock

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257

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Assy Fe

Spain . 12 parts In-Stock

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12

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Overview

Elevate your consumer electronics with the PNX1301EH/G,557 from NXP Semiconductors, a trusted leader in innovation and quality. This cutting-edge IC promises exceptional performance and reliability for diverse applications, ensuring seamless integration and enhanced functionality. Designed for efficiency, it empowers your devices to deliver superior user experiences while streamlining production processes. Choose NXP for unmatched value and innovative solutions that set your products apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable for consumer applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient board space utilization, fitting well in modern consumer electronics.

Package Shape: SQUARE

A square package shape provides uniformity in layout and ease of integration into diverse circuit designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC ensures optimal performance in everyday electronic devices.

Power Supplies: 2.5V, 3.3V

Supports dual voltage supplies, allowing flexibility in application across a variety of consumer devices that require different operating voltages.

No. of Terminals: 292

A high number of terminals enables extensive connectivity options, suitable for complex functionalities in modern consumer electronics.

Package Style: GRID ARRAY

Grid array packaging enhances thermal performance and allows for high-density mounting, which is advantageous in space-constrained applications.

Terminal Position: BOTTOM

Bottom terminals facilitate easier soldering and provide a stable connection to the PCB, improving reliability and ease of manufacturing.

Terminal Form: BALL

Ball terminals enable efficient electrical contact and contribute to a robust mechanical connection, enhancing overall product reliability.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for dense packing of ICs on PCBs while still being manageable for assembly processes, optimizing space without compromising performance.

Technical Specifications

Other Function Consumer ICs PNX1301EH/G,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B292

No. of Terminals:

292

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA292,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trade Compliance

PNX1301EH/G,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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