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IP4786CZ32,118

NXP Semiconductors

IP4786CZ32,118 by NXP Semiconductors

IP4786CZ32,118 by NXP Semiconductors is a consumer circuit IC with 32 terminals in a square chip carrier package. It operates b/w -25 to 85 °C and supports power supplies of 1.8/5,5 V. Ideal for applications requiring a very thin profile and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 180,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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6,000

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SPM Sales

USA . 5,380 parts In-Stock

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5,380

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Digiode

USA . 4,078 parts In-Stock

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4,078

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Vyrian

USA . 3,058 parts In-Stock

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3,058

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Anansix

USA . 1,794 parts In-Stock

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Speed Components Ltd

Israel . 434 parts In-Stock

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434

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Connect4Technologies Inc.

Canada . 250 parts In-Stock

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250

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Prism Electronics

USA . 171 parts In-Stock

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Nova Conductors

Japan . 39 parts In-Stock

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Corohmni

South Africa . 209 parts In-Stock

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$0.196

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Aztec Data Supply Inc.

USA . 320 parts In-Stock

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$1.160

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320

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Semicontronic

India . 418 parts In-Stock

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$11.800

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$11.505

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$11.446

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418

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$11.446

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AZTECH Wire

Italy . 810 parts In-Stock

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One Stop Electronics

USA . 1,337 parts In-Stock

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$15.800

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Continental Prestige Electronics

USA . 5,913 parts In-Stock

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Corphita

USA . 3,306 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Argo Parts USA

USA . 473 parts In-Stock

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473

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UNI Independent Distributors

Spain . 437 parts In-Stock

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Perfect Parts

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418

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Microchip USA

USA . 240 parts In-Stock

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Overview

Discover the cutting-edge technology of the IP4786CZ32,118 by NXP Semiconductors, a top-tier manufacturer in the semiconductor industry. This innovative consumer IC boasts unparalleled quality and reliability, making it ideal for a wide range of applications. Unlock the full potential of your electronic devices with this high-performance chip carrier that offers exceptional power supplies, a very thin profile, and a quad terminal position. Elevate your products to the next level with the IP4786CZ32,118 and experience unmatched efficiency, precision, and durability. Your customers deserve nothing but the best – give them the advantage of NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs.

Package Shape: SQUARE

Square shape facilitates compact and efficient PCB design, maximizing space utilization.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, making it suitable for a wide range of electronic devices.

Power Supplies (V): 1.8/5,5

Supports multiple power supply options, offering flexibility in usage scenarios.

No. of Terminals: 32

Sufficient number of terminals for connecting various components and peripherals.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stable performance in challenging environments.

Minimum Operating Temperature: -25 °C

Wide temperature range enables operation in both hot and cold conditions.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure soldering during assembly.

Width: 5 mm

Compact width enables space-efficient PCB layout and design.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for operation in low power scenarios.

Maximum Seated Height: 0.85 mm

Low seated height enhances PCB profile and overall compactness of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer versatility in design and application, catering to diverse requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for proper reflow soldering process, ensuring quality and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for robust soldering and thermal performance.

Length: 5 mm

Compact length complements width dimension for overall space efficiency.

Terminal Form: NO LEAD

Lead-free terminal form meets environmental standards and regulations, ensuring eco-friendly usage.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB designs and compact layouts.

Maximum Supply Voltage (Vsup): 6.5 V

High maximum supply voltage tolerance provides safety margin and flexibility in power input.

Technical Specifications

Other Function Consumer ICs IP4786CZ32,118 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

Additional Features:

SEATED HGT-NOM

General IC Type:

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5,5

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

IP4786CZ32,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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