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IP4786CZ32

NXP Semiconductors

IP4786CZ32 by NXP Semiconductors

NXP Semiconductors' IP4786CZ32 is a consumer circuit IC with 1 function. It has a square package shape, 32 terminals, and a very thin profile. It operates b/w -25 to 85 °C and is suitable for various applications requiring low voltage supply.

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Lifecycle Status

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8

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1k+

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Chip Stock

USA . 18,908 parts In-Stock

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Vyrian

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Digiode

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Anansix

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ACDS - Activité Composants Distribution Service

France . 654 parts In-Stock

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654

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Nova Conductors

Japan . 500 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Corohmni

South Africa . 243 parts In-Stock

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$1.116

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Aztec Data Supply Inc.

USA . 321 parts In-Stock

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One Stop Electronics

USA . 1,331 parts In-Stock

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$9.800

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Ampacity Inc.

Singapore . 570 parts In-Stock

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AZTECH Wire

Italy . 5,832 parts In-Stock

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RC Electronics

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Lixinc

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Kepictronics

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S.R.D Solutions

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Argo Parts USA

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Continental Prestige Electronics

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A-Z Elektronik GmbH

Germany . 2,630 parts In-Stock

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Corphita

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Aranea Global

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Alle Elektronik GmbH

Germany . 1,753 parts In-Stock

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Assy Fe

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Infinite Electronics LLP (Excess)

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Cyclops Electronics Ltd (Excess)

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UNI Independent Distributors

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Supply Digital

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Overview

Discover the IP4786CZ32 by NXP Semiconductors, a top-quality consumer IC that delivers exceptional performance and reliability. Manufactured by the renowned NXP Semiconductors, this cutting-edge chip offers countless advantages in a variety of applications. With its compact square design and easy surface mount installation, it seamlessly integrates into any circuit. Experience the value and benefits of this versatile chip, providing enhanced functionality and efficiency to your projects. Join the countless satisfied customers who have discovered the advantages of the IP4786CZ32 and take your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the IC, making it a reliable choice for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and enhancing the overall design of the product.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and heat dissipation, contributing to better performance and reliability of the IC.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and corrosion resistance, improving the longevity and stability of the IC.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for energy-efficient operation and compatibility with a wide range of power sources.

Technical Specifications

Other Function Consumer ICs IP4786CZ32 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

IP4786CZ32 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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