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LM8342SDX

Texas Instruments

LM8342SDX by Texas Instruments

LM8342SDX by Texas Instruments is a small outline, heat sink IC with 10 terminals. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage range of 2.25V to 3.6V. Ideal for consumer circuits, this surface-mount IC is designed for applications requiring a very thin profile package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,581 parts In-Stock

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2,581

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Anansix

USA . 2,542 parts In-Stock

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2,542

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Vyrian

USA . 1,995 parts In-Stock

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1,995

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Parana Technologies

USA . 1,813 parts In-Stock

1+ parts

$2.663

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$3.150

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1,813

$2.663

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$3.150

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DigiPath Technology Company

USA . 626 parts In-Stock

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$2.932

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$2.698

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626

$2.932

$2.698

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IDEA Electronic Components Group

UK . 1,570 parts In-Stock

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$2.992

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$2.693

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1,570

$2.992

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$2.693

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ChromeModa Solutions

Germany . 1,435 parts In-Stock

1+ parts

$2.992

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$2.453

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1,435

$2.992

$2.453

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One Stop Electronics

USA . 1,544 parts In-Stock

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$7.800

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$7.800

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AZTECH Wire

Italy . 865 parts In-Stock

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$9.718

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865

$9.718

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Ampacity Inc.

Singapore . 1,194 parts In-Stock

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$13.800

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$13.800

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QUARKTWIN TECHNOLOGY LTD

USA . 28,017 parts In-Stock

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Microchip USA

USA . 5,148 parts In-Stock

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Corphita

USA . 5,052 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 3,273 parts In-Stock

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Continental Prestige Electronics

USA . 1,922 parts In-Stock

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1,922

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the LM8342SDX by Texas Instruments, a cutting-edge consumer circuit that offers unparalleled performance and reliability. With a small outline, very thin profile design, this innovative product is perfect for a wide range of applications. Designed with precision and expertise by Texas Instruments, this IC ensures high-quality results every time. Whether you're looking to optimize your electronics or enhance your projects, the LM8342SDX provides the value, benefits, and advantages you need to succeed. Trust in Texas Instruments for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for consumer applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on a circuit board, saving space and simplifying the manufacturing process.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold conditions, making it versatile for various applications.

Width: 3 mm

The compact width of 3mm allows for efficient use of space on a PCB, especially important in consumer electronics where size constraints are a factor.

Minimum Supply Voltage (Vsup): 2.25 V

The low minimum supply voltage requirement of 2.25V makes this product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Consumer ICs LM8342SDX attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES ANALOG REFERENCE VOLTAGE OF 4.5V TO 18V

General IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

LM8342SDX General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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