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LM832M

Texas Instruments

LM832M by Texas Instruments

LM832M by Texas Instruments is a small outline consumer IC with 14 terminals. It operates in industrial temperature range (-40 to 85°C) and supports supply voltage from 1.5V to 9V. This rectangular package is surface mountable and suitable for various consumer circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,646 parts In-Stock

1+ parts

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100+ parts

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6,646

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Digiode

USA . 2,525 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,525

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Anansix

USA . 1,866 parts In-Stock

1+ parts

-

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1,866

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 450 parts In-Stock

1+ parts

$3.418

100+ parts

-

1k+ parts

$3.943

10k+ parts

-

450

$3.418

-

$3.943

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DigiPath Technology Company

USA . 1,370 parts In-Stock

1+ parts

$3.764

100+ parts

$3.463

1k+ parts

-

10k+ parts

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1,370

$3.764

$3.463

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One Stop Electronics

USA . 1,009 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,009

$3.800

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ChromeModa Solutions

Germany . 1,442 parts In-Stock

1+ parts

$3.841

100+ parts

$3.150

1k+ parts

-

10k+ parts

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1,442

$3.841

$3.150

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IDEA Electronic Components Group

UK . 1,169 parts In-Stock

1+ parts

$3.841

100+ parts

-

1k+ parts

$3.457

10k+ parts

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1,169

$3.841

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$3.457

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AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$16.877

100+ parts

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326

$16.877

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Corphita

USA . 1,816 parts In-Stock

1+ parts

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1,816

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Overview

Enhance your electronic projects with the LM832M by Texas Instruments, a high-quality consumer circuit IC designed to bring convenience and efficiency to a wide range of applications. Crafted with precision and expertise by Texas Instruments, this small outline package offers superior performance and reliability, making it a valuable addition to your toolkit. From smart home devices to automotive electronics, the LM832M delivers optimal functionality and versatility, ensuring seamless integration and exceptional results. Elevate your projects with the LM832M and experience the unmatched benefits it has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

Surface mount compatibility allows for easy integration into PCB designs, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape offers standard form factor for easier handling and installation in electronic devices.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring reliable performance in everyday electronic devices.

No. of Terminals: 14

Sufficient number of terminals for connecting to external components, enabling versatile circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the IC to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the IC can operate in both cold and hot environments, suitable for industrial applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections, enhancing design options for engineers.

Maximum Seated Height: 1.753 mm

Low seated height helps in compact PCB designs and allows for slim electronic devices.

Width: 3.899 mm

Narrow width enables space-saving integration of the IC in densely packed electronic assemblies.

Minimum Supply Voltage (Vsup): 1.5 V

Low minimum supply voltage requirement makes the IC energy-efficient and suitable for battery-powered devices.

Length: 8.6235 mm

Standard length facilitates easy mounting and placement of the IC on the PCB, ensuring compatibility with standard PCB sizes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range and reliability ensure the IC can withstand harsh operating conditions in industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections, enhancing the durability and reliability of the IC in electronic devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy soldering and PCB assembly, ensuring compatibility with common manufacturing processes.

Maximum Supply Voltage (Vsup): 9 V

High maximum supply voltage capability provides versatility in power supply options for the IC, making it suitable for a wide range of applications.

Technical Specifications

Other Function Consumer ICs LM832M attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.6235 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.753 mm

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.899 mm

Trade Compliance

LM832M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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