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LM8300IMT9B

Texas Instruments

LM8300IMT9B by Texas Instruments

LM8300IMT9B by Texas Instruments is a consumer IC with 48 terminals in a small outline package. It operates b/w 0-70°C, with power supplies of 3/5V. Suitable for various consumer circuit applications due to its compact size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,596 parts In-Stock

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7,596

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Anansix

USA . 2,033 parts In-Stock

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2,033

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Digiode

USA . 1,147 parts In-Stock

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1,147

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Manoshevitz Elec. Sales

Israel . 60 parts In-Stock

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60

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Distributors (Availability)

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One Stop Electronics

USA . 326 parts In-Stock

1+ parts

$2.800

100+ parts

-

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326

$2.800

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Parana Technologies

USA . 330 parts In-Stock

1+ parts

$3.463

100+ parts

$321.591

1k+ parts

$3.117

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330

$3.463

$321.591

$3.117

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DigiPath Technology Company

USA . 2,154 parts In-Stock

1+ parts

$3.813

100+ parts

$3.508

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2,154

$3.813

$3.508

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ChromeModa Solutions

Germany . 4,421 parts In-Stock

1+ parts

$3.891

100+ parts

$3.191

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4,421

$3.891

$3.191

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IDEA Electronic Components Group

UK . 390 parts In-Stock

1+ parts

$3.891

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$3.502

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390

$3.891

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$3.502

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$13.391

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789

$13.391

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QUARKTWIN TECHNOLOGY LTD

USA . 29,153 parts In-Stock

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29,153

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Microchip USA

USA . 6,425 parts In-Stock

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6,425

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Corphita

USA . 3,944 parts In-Stock

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3,944

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Overview

Elevate your consumer electronics with the LM8300IMT9B by Texas Instruments. Crafted with precision and quality, this innovative IC offers unparalleled performance in a compact package. Whether you're designing smart home devices or portable gadgets, this versatile component delivers efficiency and reliability. Trust in Texas Instruments to provide cutting-edge solutions for all your electronics needs. Upgrade your products today with the LM8300IMT9B and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on PCBs, saving time during manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape facilitates space-saving on the circuit board and allows for efficient placement in compact electronic devices.

Power Supplies (V): 3/5

The ability to operate on both 3V and 5V power supplies gives flexibility in design and compatibility with a wide range of power sources.

No. of Terminals: 48

Having 48 terminals enables the IC to interface with multiple components and peripherals, increasing functionality and versatility.

Width: 6.1 mm

The compact width of 6.1mm allows for the IC to be used in tight spaces and compact electronic devices without sacrificing functionality.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7V enhances efficiency and energy savings in operation.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance within standard temperature ranges, making it suitable for commercial applications.

Technical Specifications

Other Function Consumer ICs LM8300IMT9B attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6.1 mm

Trade Compliance

LM8300IMT9B General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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