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LM8325DGR8-1/NOPB

Texas Instruments

LM8325DGR8-1/NOPB by Texas Instruments

LM8325DGR8-1/NOPB by Texas Instruments is a 25-terminal consumer IC with a thin profile and fine pitch grid array package. It operates in industrial temperature range (-40 to 85°C) with supply voltage from 1.62V to 1.98V, making it suitable for various consumer circuit applications.

Median Price

$3.427

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,945 parts In-Stock

1+ parts

$3.427

100+ parts

$2.831

1k+ parts

$1.530

10k+ parts

-

13,945

$3.427

$2.831

$1.530

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,732 parts In-Stock

1+ parts

$3.256

100+ parts

-

1k+ parts

-

10k+ parts

-

4,732

$3.256

-

-

-

Vyrian

USA . 4,824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,824

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 27 parts In-Stock

1+ parts

$0.442

100+ parts

-

1k+ parts

$1.604

10k+ parts

-

27

$0.442

-

$1.604

-

ChromeModa Solutions

Germany . 1,733 parts In-Stock

1+ parts

$0.497

100+ parts

$0.408

1k+ parts

-

10k+ parts

-

1,733

$0.497

$0.408

-

-

IDEA Electronic Components Group

UK . 954 parts In-Stock

1+ parts

$0.497

100+ parts

-

1k+ parts

$0.447

10k+ parts

-

954

$0.497

-

$0.447

-

Corphita

USA . 1,439 parts In-Stock

1+ parts

$3.084

100+ parts

-

1k+ parts

-

10k+ parts

-

1,439

$3.084

-

-

-

Microchip USA

USA . 1,178 parts In-Stock

1+ parts

$14.060

100+ parts

$13.980

1k+ parts

$13.930

10k+ parts

$13.890

1,178

$14.060

$13.980

$13.930

$13.890

AZTECH Wire

Italy . 728 parts In-Stock

1+ parts

$18.080

100+ parts

-

1k+ parts

-

10k+ parts

-

728

$18.080

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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25,768

-

-

-

-

DigiPath Technology Company

USA . 459 parts In-Stock

1+ parts

-

100+ parts

$0.448

1k+ parts

-

10k+ parts

-

459

-

$0.448

-

-

Overview

Elevate your consumer electronics with the LM8325DGR8-1/NOPB by Texas Instruments, a top-tier manufacturer known for quality and innovation. This cutting-edge IC offers unmatched reliability and performance in a compact package, making it ideal for a wide range of applications in the consumer electronics industry. Experience seamless integration, enhanced functionality, and superior efficiency with the LM8325DGR8-1/NOPB, delivering unparalleled value and benefits to customers looking to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the IC.

Surface Mount: YES

The surface mount capability allows for easier and more efficient installation on circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package provides a compact design that can fit well within limited space on a circuit board.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliable functionality in both extreme cold and hot environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Maximum Seated Height: 1.1 mm

The low seated height allows for a slim profile and easy integration into compact electronic devices.

Minimum Supply Voltage (Vsup): 1.62 V

The low minimum supply voltage requirement allows for efficient power consumption and compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables reliable soldering during production processes, ensuring strong connections.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating indicates high reliability and performance consistency in rugged industrial environments.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density mounting on circuit boards, saving space and allowing for more complex circuit designs.

Maximum Supply Voltage (Vsup): 1.98 V

The moderate maximum supply voltage allows for flexibility in power options while still maintaining efficient operation.

Technical Specifications

Other Function Consumer ICs LM8325DGR8-1/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

1.98 V

Minimum Supply Voltage (Vsup):

1.62 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

LM8325DGR8-1/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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