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TSC2046EIPWRG4

Texas Instruments

TSC2046EIPWRG4 by Texas Instruments

TSC2046EIPWRG4 by Texas Instruments is a 16-terminal IC with power supplies of 3/5V, operating temperature range of -40 to 85°C. It is used in consumer circuits, featuring CMOS technology and a small outline package for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 18,520 parts In-Stock

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Vyrian

USA . 7,603 parts In-Stock

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7,603

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Digiode

USA . 117 parts In-Stock

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117

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Nova Conductors

Japan . 52 parts In-Stock

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52

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Distributors (Availability)

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Corohmni

South Africa . 17 parts In-Stock

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$1.632

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17

$1.632

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Semicontronic

India . 984 parts In-Stock

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$2.800

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$2.730

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$2.716

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984

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$2.716

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Parana Technologies

USA . 157 parts In-Stock

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$3.403

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$316.054

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$3.063

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157

$3.403

$316.054

$3.063

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DigiPath Technology Company

USA . 1,757 parts In-Stock

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$3.748

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$3.748

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ChromeModa Solutions

Germany . 3,381 parts In-Stock

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$3.824

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$3.136

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

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$3.824

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$3.442

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$3.824

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$3.442

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One Stop Electronics

USA . 149 parts In-Stock

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$4.800

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AZTECH Wire

Italy . 347 parts In-Stock

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$9.729

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Ampacity Inc.

Singapore . 626 parts In-Stock

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$12.800

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A-Z Elektronik GmbH

Germany . 6,177 parts In-Stock

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Continental Prestige Electronics

USA . 5,256 parts In-Stock

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Kepictronics

USA . 2,300 parts In-Stock

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Microchip USA

USA . 1,359 parts In-Stock

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Argo Parts USA

USA . 1,189 parts In-Stock

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Corphita

USA . 937 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Unlock the full potential of your consumer electronics with the TSC2046EIPWRG4 by Texas Instruments. Renowned for their high-quality manufacturing, Texas Instruments delivers unmatched reliability and performance in the category of Other Function Consumer ICs. This versatile IC offers a wide range of applications and is designed to provide customers with exceptional value, benefits, and advantages. Experience the difference with Texas Instruments and elevate your electronic projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it long-lasting and resistant to external factors.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the IC on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB designs, making integration into existing systems seamless.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable for consumer applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in a variety of environments, increasing the versatility of the IC.

Technical Specifications

Other Function Consumer ICs TSC2046EIPWRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 1.5V TO 5.25V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TSC2046EIPWRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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