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PI3HDX1204B1ZHIEX

Diodes Incorporated

PI3HDX1204B1ZHIEX by Diodes Incorporated

PI3HDX1204B1ZHIEX by Diodes Inc. is a consumer IC with 42 terminals in a rectangular chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a terminal pitch of 0.5mm and no-lead form, it requires a supply voltage of 3-3.6V for various consumer circuit designs.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,861 parts In-Stock

1+ parts

$2.950

100+ parts

$1.813

1k+ parts

$1.683

10k+ parts

$1.541

4,861

$2.950

$1.813

$1.683

$1.541

Mouser Electronics

USA . 4,686 parts In-Stock

1+ parts

$2.950

100+ parts

$1.820

1k+ parts

$1.600

10k+ parts

$1.550

4,686

$2.950

$1.820

$1.600

$1.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.650

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.650

-

-

-

Vyrian

USA . 3,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,299

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,458 parts In-Stock

1+ parts

$1.650

100+ parts

-

1k+ parts

-

10k+ parts

-

3,458

$1.650

-

-

-

Continental Prestige Electronics

USA . 2,736 parts In-Stock

1+ parts

$1.650

100+ parts

-

1k+ parts

-

10k+ parts

$1.617

2,736

$1.650

-

-

$1.617

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.650

100+ parts

$1.617

1k+ parts

-

10k+ parts

-

1,000

$1.650

$1.617

-

-

Ampacity Inc.

Singapore . 3,097 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3,097

$2.880

-

-

-

Lixinc

USA . 4,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,886

-

-

-

-

Overview

Unlock the full potential of your consumer electronics with the PI3HDX1204B1ZHIEX by Diodes Incorporated. This high-quality IC offers unmatched performance and reliability, thanks to the renowned reputation of its manufacturer. Perfect for a wide range of applications in the consumer electronics industry, this product delivers exceptional value, benefits, and advantages to customers seeking superior quality and functionality. Say goodbye to compromise and experience the difference with the PI3HDX1204B1ZHIEX.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact design, making it suitable for applications where space is limited.

Package Shape: RECTANGULAR

Rectangular package shape provides ease of handling and placement in circuit boards, ensuring a more organized layout.

No. of Terminals: 42

Having a higher number of terminals allows for more connectivity options and functionalities within the consumer circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environments and ensure reliable performance under various conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for consumer applications.

Technical Specifications

Other Function Consumer ICs PI3HDX1204B1ZHIEX attributes and parameters. Explore more Other Function Consumer ICs devices from Diodes Incorporated

Specs

General IC Type:

JESD-30 Code:

R-XQCC-N42

Length:

9 mm

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

PI3HDX1204B1ZHIEX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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