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TEA5767HN/V2

NXP Semiconductors

TEA5767HN/V2 by NXP Semiconductors

TEA5767HN/V2 by NXP Semiconductors is a FM demodulator IC with 40 terminals, operating at -10 to 75°C. It has power supplies of 3/5V and is ideal for consumer electronics applications due to its bipolar technology and square chip carrier package style.

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LIBRA Elektronik GmbH

Germany . 5,102 parts In-Stock

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Digiode

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Anansix

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Vyrian

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ComSIT Distribution GmbH

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ComSIT USA

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Nova Conductors

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ECAB

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AZTECH Wire

Italy . 660 parts In-Stock

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Ampacity Inc.

Singapore . 378 parts In-Stock

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One Stop Electronics

USA . 1,211 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,498 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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UNI Independent Distributors

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Authorized Procurement Solutions

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Assy Fe

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Bastille Electronics

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Overview

Experience crystal-clear sound quality like never before with the TEA5767HN/V2 by NXP Semiconductors. This innovative chip carrier boasts unparalleled performance and reliability, making it perfect for a wide range of consumer electronic applications. With a temperature grade of commercial extended and bipolar technology, this product ensures optimal functionality in any environment. Say goodbye to static and interference and hello to seamless FM demodulation with the TEA5767HN/V2. Upgrade your audio experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for consumer electronics applications.

Surface Mount: YES

With surface mount capability, this product can easily be integrated into compact and space-saving designs.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, making this product suitable for applications with limited area.

Power Supplies (V): 3/5

This product supports a wide range of power supplies, providing flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 40

The high number of terminals allows for multiple connections and functionality, making this product versatile and suitable for complex applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures easy handling and installation, making this product convenient for production and assembly processes.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand extended use in various environmental conditions.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature range ensures reliable performance even in cold environments.

Terminal Position: QUAD

The quad terminal position provides stable connections and reduces the risk of signal interference, enhancing the overall performance of this product.

Demodulation Type: FM

The FM demodulation type offers efficient signal processing, making this product ideal for applications requiring high-quality audio or data transmission.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable operation in a wide range of temperature conditions, making this product suitable for commercial and industrial applications.

Technology: BIPOLAR

The bipolar technology used in this product offers high performance and precision, making it a reliable choice for demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of soldering issues and enhances the overall reliability of this product.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact layout designs and high-density integration, making this product suitable for space-constrained applications.

Technical Specifications

Other Function Consumer ICs TEA5767HN/V2 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

Demodulation Type:

FM

JESD-30 Code:

S-PQCC-N40

No. of Terminals:

40

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TEA5767HN/V2 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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