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TDA18273HN/C1,518

NXP Semiconductors

TDA18273HN/C1,518 by NXP Semiconductors

TDA18273HN/C1,518 by NXP Semiconductors is a 40-terminal IC with a power supply of 3.3V. It comes in a square chip carrier package and is surface mountable. This IC is commonly used in consumer electronics for various functions due to its compact size and high performance capabilities.

Median Price

$1.310

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 16 parts In-Stock

1+ parts

$0.153

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16

$0.153

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DigiKey

USA . 218,999 parts In-Stock

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$1.210

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218,999

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$1.210

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Rochester

USA . 218,821 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.170

10k+ parts

$1.040

218,821

-

$1.410

$1.170

$1.040

Verical

USA . 186,822 parts In-Stock

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$1.462

10k+ parts

$1.300

186,822

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-

$1.462

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 905 parts In-Stock

1+ parts

$0.145

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905

$0.145

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Vyrian

USA . 101,276 parts In-Stock

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101,276

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Anansix

USA . 109 parts In-Stock

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109

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Nova Conductors

Japan . 16 parts In-Stock

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 156,133 parts In-Stock

1+ parts

$0.130

100+ parts

$0.127

1k+ parts

$0.126

10k+ parts

-

156,133

$0.130

$0.127

$0.126

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Ampacity Inc.

Singapore . 101,361 parts In-Stock

1+ parts

$0.130

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101,361

$0.130

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Corphita

USA . 2,421 parts In-Stock

1+ parts

$0.138

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2,421

$0.138

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Aztec Data Supply Inc.

USA . 4,012 parts In-Stock

1+ parts

$1.080

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4,012

$1.080

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$1.530

100+ parts

$1.453

1k+ parts

$1.453

10k+ parts

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650

$1.530

$1.453

$1.453

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Microchip USA

USA . 239 parts In-Stock

1+ parts

$2.135

100+ parts

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239

$2.135

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Argo Parts USA

USA . 3,229 parts In-Stock

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3,229

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UNI Independent Distributors

Spain . 3,096 parts In-Stock

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3,096

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Continental Prestige Electronics

USA . 2,978 parts In-Stock

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2,978

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100

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Overview

Unlock a world of seamless entertainment with the TDA18273HN/C1,518 by NXP Semiconductors. Crafted with precision and expertise, this high-quality consumer IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product promises to elevate your audio and video experience. With its advanced technology and innovative design, customers can enjoy crystal-clear sound and vibrant visuals like never before. Upgrade your devices today with the TDA18273HN/C1,518 and immerse yourself in a whole new level of entertainment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving on PCBs, making it convenient for compact electronic devices.

Package Shape: SQUARE

The square shape of the package provides a uniform and compact layout, optimizing space utilization on the PCB.

Power Supplies (V): 3.3

With a power supply of 3.3 volts, this IC is suitable for low-power applications, making it energy-efficient and cost-effective.

No. of Terminals: 40

With 40 terminals, this IC offers plenty of connectivity options for interfacing with other components, allowing for versatile functionalities.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal performance and protection, ensuring the IC's reliability and long lifespan.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and connection of signals, enhancing the overall performance and reliability of the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure soldering during assembly, reducing the risk of damage and ensuring reliable operation.

Terminal Form: NO LEAD

The no-lead terminal form enhances the IC's reliability by reducing the risk of solder joint failure, making it a durable and long-lasting choice.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm provides high-density interconnection capabilities, allowing for compact PCB designs and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC is resistant to moisture and humidity, ensuring consistent performance in various environmental conditions.

Technical Specifications

Other Function Consumer ICs TDA18273HN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18273HN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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