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TDA10025HN/C1,551

NXP Semiconductors

TDA10025HN/C1,551 by NXP Semiconductors

TDA10025HN/C1,551 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates on power supplies of 1.2V and 3.3V, features a compact 48-terminal quad package, and withstands peak reflow temps up to 260 °C. Ideal for advanced electronic systems requiring efficient signal processing.

Median Price

$2.275

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 6,500 parts In-Stock

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6,500

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Rochester

USA . 520 parts In-Stock

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$2.030

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$1.820

10k+ parts

$1.710

520

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$2.030

$1.820

$1.710

DigiKey

USA . 520 parts In-Stock

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$2.350

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520

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$2.350

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Verical

USA . 520 parts In-Stock

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$2.275

10k+ parts

$2.138

520

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$2.275

$2.138

Distributors (In-Stock)

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Digiode

USA . 755 parts In-Stock

1+ parts

$2.147

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755

$2.147

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Flip Electronics

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 2,037 parts In-Stock

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2,037

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Anansix

USA . 1,918 parts In-Stock

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1,918

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Distributors (Availability)

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Corphita

USA . 1,948 parts In-Stock

1+ parts

$2.034

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1,948

$2.034

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Microchip USA

USA . 141 parts In-Stock

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$3.236

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141

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UNI Independent Distributors

Spain . 2,648 parts In-Stock

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Overview

Discover the exceptional performance of the TDA10025HN/C1,551 from NXP Semiconductors—a leader in innovation and quality. This versatile consumer IC seamlessly integrates into various applications, delivering reliability and superior efficiency. With its compact design and advanced technology, it enhances your product's capabilities while simplifying integration. Trust NXP for unmatched support and expertise, ensuring you stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for higher circuit density, enabling compact designs and facilitating automated assembly processes.

Package Shape: SQUARE

The square package shape optimizes space utilization on printed circuit boards, making it suitable for space-constrained designs.

Power Supplies (V): 1.2, 3.3

Support for multiple voltage levels (1.2V and 3.3V) makes this IC versatile and compatible with a variety of electronic systems.

No. of Terminals: 48

A total of 48 terminals provides ample connectivity options, enabling extensive functionality and integration in complex applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is ideal for high-performance applications, ensuring efficient heat dissipation and electrical performance.

Terminal Position: QUAD

Quad terminal positioning supports a balanced layout, which can improve signal integrity and reduce the likelihood of electrical noise.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with standard soldering processes, facilitating easier and reliable assembly.

Terminal Form: NO LEAD

No lead design helps minimize the product's footprint and enhances overall reliability by reducing solder joint fatigue issues.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density mounting, making it suitable for compact PCB layouts without compromising performance.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product requires caution during storage and handling, but it is still designed for longer shelf life, reducing risks of moisture-related damage.

Technical Specifications

Other Function Consumer ICs TDA10025HN/C1,551 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA10025HN/C1,551 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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