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TDA10025HN/C1,518

NXP Semiconductors

TDA10025HN/C1,518 by NXP Semiconductors

TDA10025HN/C1,518 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at power supplies of 1.2V and 3.3V, features a compact 48-terminal quad package, and withstands peak reflow temps up to 260 °C. Ideal for advanced electronic devices requiring efficient signal processing.

Median Price

$2.175

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 6,500 parts In-Stock

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6,500

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Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$1.950

1k+ parts

$1.740

10k+ parts

$1.640

4,000

-

$1.950

$1.740

$1.640

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.250

10k+ parts

$2.250

4,000

-

-

$2.250

$2.250

Verical

USA . 4,000 parts In-Stock

1+ parts

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1k+ parts

$2.175

10k+ parts

$2.050

4,000

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-

$2.175

$2.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,200 parts In-Stock

1+ parts

$2.052

100+ parts

-

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3,200

$2.052

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Vyrian

USA . 3,881 parts In-Stock

1+ parts

$2.160

100+ parts

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3,881

$2.160

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Flip Electronics

USA . 6,500 parts In-Stock

1+ parts

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6,500

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Anansix

USA . 2,783 parts In-Stock

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2,783

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,061 parts In-Stock

1+ parts

$1.944

100+ parts

-

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3,061

$1.944

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Microchip USA

USA . 269 parts In-Stock

1+ parts

$3.057

100+ parts

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269

$3.057

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UNI Independent Distributors

Spain . 5,540 parts In-Stock

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5,540

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Overview

Elevate your electronic designs with the TDA10025HN/C1,518 from NXP Semiconductors—a leader in innovation and quality. This versatile consumer IC is engineered for seamless integration, ensuring reliable performance across diverse applications. With a commitment to excellence, NXP provides unmatched support and durability, giving you peace of mind. Harness the power of cutting-edge technology and unlock new possibilities for enhanced functionality and efficiency in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protects the IC from environmental factors, making it reliable for long-term applications.

Surface Mount: YES

Surface mount technology allows for compact designs, enabling higher density layouts and reducing the overall footprint of the PCB.

Package Shape: SQUARE

A square package shape facilitates uniform thermal distribution and efficient space utilization, which is ideal for compact electronic designs.

Power Supplies (V): 1.2, 3.3

Dual power supply options enhance flexibility for various designs, allowing compatibility with a wide range of voltage levels in modern electronic systems.

No. of Terminals: 48

With 48 terminals, this IC can support complex functionalities and integrate multiple connections in a single package, ideal for advanced applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for efficient heat dissipation and is suitable for high-performance applications, ensuring reliability during operation.

Terminal Position: QUAD

Quad terminal positioning improves access for soldering and enhances signal integrity, promoting better performance in communication and processing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with standard lead-free soldering processes, aligning with modern manufacturing practices.

Terminal Form: NO LEAD

No lead design minimizes the footprint and allows for greater flexibility in layout options, suitable for high-density PCB designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables higher density connections, facilitating compact designs crucial for the advancement of smaller electronic devices.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, allowing for effective handling and storage protocols, making it suitable for various manufacturing environments.

Technical Specifications

Other Function Consumer ICs TDA10025HN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA10025HN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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