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TEA5582PN

NXP Semiconductors

TEA5582PN by NXP Semiconductors

TEA5582PN by NXP Semiconductors is a consumer IC designed for versatile applications. It operates b/w 7V and 16V, with a max current of 25mA, and features a compact rectangular package (26.73mm x 7.62mm). Ideal for various consumer electronics, it withstands temps from 0 °C to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,021 parts In-Stock

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3,021

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Digiode

USA . 2,730 parts In-Stock

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2,730

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Anansix

USA . 1,860 parts In-Stock

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1,860

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 182 parts In-Stock

1+ parts

$13.800

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182

$13.800

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UNI Independent Distributors

Spain . 4,554 parts In-Stock

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Corphita

USA . 4,503 parts In-Stock

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4,503

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Overview

Unlock the potential of your designs with the TEA5582PN from NXP Semiconductors, a leader in quality and innovation. This versatile consumer IC is engineered for reliability and efficiency, making it perfect for a range of applications from automotive to home appliances. With its robust temperature range and durable packaging, you can trust in its performance, ensuring your products stand out in today’s competitive market. Elevate your projects with NXP—where excellence meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers a lightweight and durable solution that protects the integrated circuit from environmental stress while ensuring reliability.

Package Shape: RECTANGULAR

A rectangular shape optimizes space utilization on printed circuit boards, making it easier to design compact electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC meets the performance standards required for various household and personal electronics.

No. of Terminals: 20

With 20 terminals, this IC provides ample connection points for versatile functionality and ease of integration into complex circuits.

Package Style (Meter): IN-LINE

The in-line package style allows for efficient mounting and alignment in automated assembly processes, reducing manufacturing overhead.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures that the IC can handle moderately high temperatures, enhancing its suitability for consumer electronics.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C means this IC is versatile enough for a range of environments and applications, including those that may experience low temperatures.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible circuit design and board layout, optimizing routing and connectivity options.

Maximum Seated Height: 4.2 mm

A maximum seated height of 4.2 mm allows for low-profile designs that can fit within slim devices without compromising performance.

Width: 7.62 mm

The compact width of 7.62 mm enables integration into densely packed electronic assemblies, providing space-saving solutions.

Minimum Supply Voltage (Vsup): 7 V

The minimum supply voltage of 7 V ensures compatibility with a wide range of power supplies, enhancing flexibility in design.

Length: 26.73 mm

At a length of 26.73 mm, this IC maintains a manageable size that balances performance with integration ease in various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates suitability for standard consumer environments, ensuring reliable operation in everyday conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical support and make it easy to solder the IC onto the PCB, enhancing durability.

Maximum Supply Current: 25 mA

With a maximum supply current of 25 mA, this IC can efficiently drive connected devices without overloading the circuit.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for compatibility with standard PCB layouts, facilitating integration into existing designs.

Maximum Supply Voltage (Vsup): 16 V

The maximum supply voltage of 16 V provides a broad range of input voltage applicability, accommodating various power supply designs.

Technical Specifications

Other Function Consumer ICs TEA5582PN attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TEA5582PN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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