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VSP2267GSJR

Texas Instruments

VSP2267GSJR by Texas Instruments

VSP2267GSJR by Texas Instruments is a consumer IC with 96 terminals in a square package. It operates b/w -25°C to 85°C, with supply voltage ranging from 3V to 3.6V. This CMOS technology IC is ideal for applications requiring fine pitch and thin profile components.

Median Price

$0.410

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$0.410

-

-

-

Vyrian

USA . 3,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

-

-

-

-

Digiode

USA . 1,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 544 parts In-Stock

1+ parts

$1.618

100+ parts

$150.258

1k+ parts

$1.456

10k+ parts

-

544

$1.618

$150.258

$1.456

-

DigiPath Technology Company

USA . 20 parts In-Stock

1+ parts

$1.782

100+ parts

$1.639

1k+ parts

-

10k+ parts

-

20

$1.782

$1.639

-

-

ChromeModa Solutions

Germany . 6,027 parts In-Stock

1+ parts

$1.818

100+ parts

$1.491

1k+ parts

-

10k+ parts

-

6,027

$1.818

$1.491

-

-

IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$1.818

100+ parts

-

1k+ parts

$1.636

10k+ parts

-

592

$1.818

-

$1.636

-

AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$11.676

100+ parts

-

1k+ parts

-

10k+ parts

-

790

$11.676

-

-

-

Ampacity Inc.

Singapore . 905 parts In-Stock

1+ parts

$13.800

100+ parts

-

1k+ parts

-

10k+ parts

-

905

$13.800

-

-

-

One Stop Electronics

USA . 217 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

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217

$14.800

-

-

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Continental Prestige Electronics

USA . 5,655 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,655

-

-

-

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Corphita

USA . 3,871 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,871

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-

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Argo Parts USA

USA . 2,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,749

-

-

-

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Microchip USA

USA . 179 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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179

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-

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Bastille Electronics

Australia . 84 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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84

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-

Overview

Elevate your electronic designs with the VSP2267GSJR by Texas Instruments, a cutting-edge Consumer IC that promises top-notch quality and reliability. This versatile component boasts a myriad of applications in various industries, offering immense value and benefits to customers seeking high-performance solutions. With Texas Instruments' stellar reputation for innovation and precision engineering, you can trust this product to deliver exceptional results in a compact form factor. Say goodbye to compromises and hello to superior performance with the VSP2267GSJR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable consumer electronics.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs in manufacturing.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring optimal performance and functionality for everyday use.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand heat and maintain stability in various environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows the IC to function reliably even in cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable for consumer devices.

Technical Specifications

Other Function Consumer ICs VSP2267GSJR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B96

Length:

9 mm

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Trade Compliance

VSP2267GSJR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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