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VSP2210Y/2K

Texas Instruments

VSP2210Y/2K by Texas Instruments

VSP2210Y/2K by Texas Instruments is a consumer IC with 48 terminals in a flatpack, low profile package. It operates b/w -25°C to 85°C and requires a supply voltage of 2.7V to 3.6V. Ideal for applications requiring a compact design and high performance in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,226 parts In-Stock

1+ parts

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7,226

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Digiode

USA . 1,033 parts In-Stock

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1,033

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,318 parts In-Stock

1+ parts

$3.436

100+ parts

-

1k+ parts

$3.961

10k+ parts

-

1,318

$3.436

-

$3.961

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DigiPath Technology Company

USA . 401 parts In-Stock

1+ parts

$3.784

100+ parts

$3.481

1k+ parts

-

10k+ parts

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401

$3.784

$3.481

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ChromeModa Solutions

Germany . 4,444 parts In-Stock

1+ parts

$3.861

100+ parts

$3.166

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-

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4,444

$3.861

$3.166

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IDEA Electronic Components Group

UK . 1,824 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

$3.475

10k+ parts

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1,824

$3.861

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$3.475

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$16.243

100+ parts

-

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660

$16.243

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One Stop Electronics

USA . 1,461 parts In-Stock

1+ parts

$21.800

100+ parts

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1,461

$21.800

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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A-Z Elektronik GmbH

Germany . 6,231 parts In-Stock

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6,231

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Corphita

USA . 3,908 parts In-Stock

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3,908

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Microchip USA

USA . 247 parts In-Stock

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247

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Overview

The VSP2210Y/2K by Texas Instruments is a cutting-edge consumer IC that stands out for its high quality and reliability. Designed with precision and expertise, this product offers a wide range of applications in various industries. With Texas Instruments' reputation for excellence in manufacturing, customers can trust that they are investing in a top-tier product. Experience seamless performance, enhanced efficiency, and unparalleled value with the VSP2210Y/2K. Discover the difference that this innovative IC can make in your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability enhances the ease of manufacturing and allows for compact design, saving space on the PCB.

Package Shape: SQUARE

Square package shape helps in efficient placement on the PCB, optimizing space utilization.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The wide range of minimum operating temperature ensures the product can operate in various environments without any issues.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement enables the product to be powered by a wide range of power sources, enhancing its flexibility.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance protects the product from voltage fluctuations and ensures stable operation.

Technical Specifications

Other Function Consumer ICs VSP2210Y/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VSP2210Y/2K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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