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VSP2230Y/2K

Texas Instruments

VSP2230Y/2K by Texas Instruments

VSP2230Y/2K by Texas Instruments is a 48-terminal consumer IC with operating temperature range of 0-85°C. It features GULL WING terminals, low profile FLATPACK package style, and operates at supply voltage b/w 2.7-3.6 V. Ideal for various consumer circuit applications requiring compact design and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,253

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-

-

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Vyrian

USA . 2,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,225

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 96 parts In-Stock

1+ parts

$2.032

100+ parts

-

1k+ parts

$2.555

10k+ parts

-

96

$2.032

-

$2.555

-

ChromeModa Solutions

Germany . 971 parts In-Stock

1+ parts

$2.283

100+ parts

$1.872

1k+ parts

-

10k+ parts

-

971

$2.283

$1.872

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IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$2.283

100+ parts

-

1k+ parts

$2.055

10k+ parts

-

41

$2.283

-

$2.055

-

One Stop Electronics

USA . 1,268 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,268

$12.800

-

-

-

AZTECH Wire

Italy . 728 parts In-Stock

1+ parts

$16.180

100+ parts

-

1k+ parts

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10k+ parts

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728

$16.180

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Corphita

USA . 3,354 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,354

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-

-

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DigiPath Technology Company

USA . 889 parts In-Stock

1+ parts

-

100+ parts

$2.058

1k+ parts

-

10k+ parts

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889

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$2.058

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Microchip USA

USA . 497 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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497

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Overview

Enhance your consumer electronic designs with the VSP2230Y/2K by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of applications in the category of Other Function Consumer ICs. This innovative product boasts a package body material made of durable PLASTIC/EPOXY, ensuring long-lasting performance. With a sleek square package shape and surface mount capabilities, this consumer circuit will fit seamlessly into your design. Experience the value and benefits of the VSP2230Y/2K, providing superior functionality and efficiency to elevate your electronic devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is lightweight, durable, and cost-effective, making this product suitable for consumer applications where weight and cost are key considerations.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: SQUARE

Square package shape saves space on the PCB and allows for efficient layout design in tight spaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions and ensure reliable performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can operate effectively even in cold environments.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection to the PCB, reducing the risk of disconnection or signal loss.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement of 2.7V makes this product energy-efficient and suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form offers high reliability and easy soldering during assembly, improving overall product quality and consistency.

Technical Specifications

Other Function Consumer ICs VSP2230Y/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VSP2230Y/2K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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