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VSP2212M

Texas Instruments

VSP2212M by Texas Instruments

VSP2212M by Texas Instruments is a 48-terminal consumer IC with CMOS technology. It operates b/w -25°C to 85°C, suitable for various consumer circuit applications. This surface-mount chip carrier has a very thin profile and requires a supply voltage of 2.7V to 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,609 parts In-Stock

1+ parts

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3,609

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Vyrian

USA . 2,653 parts In-Stock

1+ parts

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2,653

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,139 parts In-Stock

1+ parts

$2.588

100+ parts

-

1k+ parts

$3.080

10k+ parts

-

1,139

$2.588

-

$3.080

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DigiPath Technology Company

USA . 637 parts In-Stock

1+ parts

$2.850

100+ parts

-

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637

$2.850

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ChromeModa Solutions

Germany . 3,477 parts In-Stock

1+ parts

$2.908

100+ parts

$2.385

1k+ parts

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3,477

$2.908

$2.385

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IDEA Electronic Components Group

UK . 1,622 parts In-Stock

1+ parts

$2.908

100+ parts

-

1k+ parts

$2.617

10k+ parts

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1,622

$2.908

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$2.617

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AZTECH Wire

Italy . 452 parts In-Stock

1+ parts

$5.455

100+ parts

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452

$5.455

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One Stop Electronics

USA . 1,462 parts In-Stock

1+ parts

$14.800

100+ parts

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1,462

$14.800

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Corphita

USA . 5,115 parts In-Stock

1+ parts

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5,115

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A-Z Elektronik GmbH

Germany . 2,184 parts In-Stock

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2,184

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Kepictronics

USA . 900 parts In-Stock

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900

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Overview

Enhance your electronic projects with the VSP2212M by Texas Instruments, a high-quality consumer IC that offers unmatched performance and reliability. Designed with precision by a leading manufacturer in the industry, this chip carrier boasts a very thin profile and 48 terminals for seamless integration. Perfect for a wide range of applications, from smart home devices to wearable technology, the VSP2212M ensures optimal functionality and efficiency. Experience the value and benefits of Texas Instruments' innovative technology with this versatile IC.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Package Shape: SQUARE

Square package shape provides a symmetrical layout, making it easier to align and mount on the PCB.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronic applications, ensuring compatibility and optimal performance in such devices.

No. of Terminals: 48

Ample number of terminals allow for complex circuit connections and functionality in consumer electronic devices.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier with a very thin profile saves space on the PCB and enables compact electronic designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability in varying environmental conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for operation in colder environments without performance degradation.

Terminal Position: QUAD

Quad terminal position simplifies the soldering and connection process, ensuring a secure and reliable electrical connection.

Maximum Seated Height: 1 mm

Low seated height allows for a compact overall design, suitable for space-constrained electronic devices.

Width: 7.2 mm

Narrow width helps in optimizing PCB layout and component placement, especially in small electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage makes the IC suitable for battery-powered devices, conserving power and extending battery life.

Length: 7.2 mm

Compact length contributes to overall space-saving design, perfect for compact consumer electronic applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in consumer electronic devices.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of solder defects and improves the overall reliability of the IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density PCB designs and precise circuit connections.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage ensures compatibility with a wide range of power sources and operating conditions.

Technical Specifications

Other Function Consumer ICs VSP2212M attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.2 mm

Trade Compliance

VSP2212M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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