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VSP2101Y

Texas Instruments

VSP2101Y by Texas Instruments

VSP2101Y by Texas Instruments is a 48-terminal consumer IC with CMOS technology. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.6V. This square-shaped IC in flatpack style is ideal for various consumer circuit applications requiring low profile and fine pitch packaging.

Median Price

$16.410

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,534 parts In-Stock

1+ parts

-

100+ parts

$14.200

1k+ parts

$12.710

10k+ parts

$11.960

9,534

-

$14.200

$12.710

$11.960

DigiKey

USA . 9,534 parts In-Stock

1+ parts

-

100+ parts

$16.410

1k+ parts

-

10k+ parts

-

9,534

-

$16.410

-

-

Verical

USA . 8,505 parts In-Stock

1+ parts

-

100+ parts

$17.750

1k+ parts

$15.887

10k+ parts

$14.950

8,505

-

$17.750

$15.887

$14.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,180 parts In-Stock

1+ parts

$14.991

100+ parts

-

1k+ parts

-

10k+ parts

-

1,180

$14.991

-

-

-

Vyrian

USA . 700 parts In-Stock

1+ parts

$15.780

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$15.780

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

DigiKey Marketplace

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Bristol Electronics

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Flex Direct, LLC

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

A2Z Electronics, Inc.

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 118 parts In-Stock

1+ parts

$0.293

100+ parts

$27.192

1k+ parts

$0.264

10k+ parts

-

118

$0.293

$27.192

$0.264

-

DigiPath Technology Company

USA . 1,698 parts In-Stock

1+ parts

$0.322

100+ parts

-

1k+ parts

-

10k+ parts

-

1,698

$0.322

-

-

-

ChromeModa Solutions

Germany . 4,556 parts In-Stock

1+ parts

$0.329

100+ parts

$0.270

1k+ parts

-

10k+ parts

-

4,556

$0.329

$0.270

-

-

IDEA Electronic Components Group

UK . 815 parts In-Stock

1+ parts

$0.329

100+ parts

-

1k+ parts

$0.296

10k+ parts

-

815

$0.329

-

$0.296

-

One Stop Electronics

USA . 9,166 parts In-Stock

1+ parts

$13.410

100+ parts

-

1k+ parts

-

10k+ parts

-

9,166

$13.410

-

-

-

Corphita

USA . 4,020 parts In-Stock

1+ parts

$14.202

100+ parts

-

1k+ parts

-

10k+ parts

-

4,020

$14.202

-

-

-

Component Stockers USA

USA . 685 parts In-Stock

1+ parts

$16.320

100+ parts

$14.060

1k+ parts

$12.310

10k+ parts

-

685

$16.320

$14.060

$12.310

-

Microchip USA

USA . 2,336 parts In-Stock

1+ parts

$27.270

100+ parts

$26.880

1k+ parts

$26.690

10k+ parts

$26.490

2,336

$27.270

$26.880

$26.690

$26.490

Perfect Parts

USA . 194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

194

-

-

-

-

Overview

Elevate your consumer electronic designs with the high-quality VSP2101Y by Texas Instruments. This cutting-edge IC offers unmatched reliability, versatility, and performance, making it a top choice for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Experience seamless integration, enhanced functionality, and superior efficiency with the VSP2101Y. Upgrade your projects today and unlock a world of possibilities with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is cost-effective and provides good insulation, making the product durable and suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards, saving space and enabling automated production processes.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics applications, this IC type ensures compatibility and reliability in everyday devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated heat levels, making it ideal for demanding usage conditions.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement allows for efficient power usage and extends battery life in portable devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall performance and efficiency of the product.

Technical Specifications

Other Function Consumer ICs VSP2101Y attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP2101Y General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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