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VSP2212Y/2M

Texas Instruments

VSP2212Y/2M by Texas Instruments

VSP2212Y/2M by Texas Instruments is a consumer IC with 48 terminals in a square chip carrier package. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.6V. This CMOS technology device is suitable for various consumer circuit applications due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,084 parts In-Stock

1+ parts

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100+ parts

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3,084

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Digiode

USA . 1,518 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,518

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 569 parts In-Stock

1+ parts

$2.479

100+ parts

-

1k+ parts

$2.970

10k+ parts

-

569

$2.479

-

$2.970

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DigiPath Technology Company

USA . 1,154 parts In-Stock

1+ parts

$2.729

100+ parts

$2.511

1k+ parts

-

10k+ parts

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1,154

$2.729

$2.511

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ChromeModa Solutions

Germany . 5,332 parts In-Stock

1+ parts

$2.785

100+ parts

$2.284

1k+ parts

-

10k+ parts

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5,332

$2.785

$2.284

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

1+ parts

$2.785

100+ parts

-

1k+ parts

$2.506

10k+ parts

-

1,739

$2.785

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$2.506

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AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$7.937

100+ parts

-

1k+ parts

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10k+ parts

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607

$7.937

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One Stop Electronics

USA . 1,910 parts In-Stock

1+ parts

$8.800

100+ parts

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1k+ parts

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10k+ parts

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1,910

$8.800

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Corphita

USA . 3,402 parts In-Stock

1+ parts

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100+ parts

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3,402

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Overview

Enhance your electronic projects with the VSP2212Y/2M by Texas Instruments, a top-tier manufacturer known for its high-quality consumer ICs. This versatile chip carrier boasts a very thin profile, making it perfect for various applications in the electronics industry. With a wide operating temperature range and innovative CMOS technology, this product offers exceptional value and performance. Upgrade your designs with the VSP2212Y/2M and experience the benefits of top-notch quality and reliability.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable PCB assembly, making it a convenient option for manufacturers.

Package Shape: SQUARE

The square package shape helps in efficient use of board space and allows for easier placement on the PCB.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is suitable for a wide range of consumer electronic devices.

No. of Terminals: 48

With a high number of terminals, this IC can accommodate multiple input and output connections, enabling complex circuit designs.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile of the chip carrier package style saves space and allows for more compact designs in electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -25 °C

The wide temperature range ensures the IC can operate in both extreme cold and hot conditions, increasing its versatility.

Terminal Position: QUAD

The quad terminal position provides stable connections and simplifies PCB layout, making it easier to integrate into electronic systems.

Maximum Seated Height: 1 mm

The low seated height of the IC allows for slim and compact device designs, which is ideal for space-constrained applications.

Width: 7.2 mm

The compact width of the IC contributes to its small form factor, making it suitable for miniaturized electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

With a low minimum supply voltage, this IC can operate efficiently even with limited power sources, enhancing energy efficiency.

Length: 7.2 mm

The short length of the IC further contributes to its compact design, allowing for space-saving integration in electronic products.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies PCB assembly and reduces the risk of solder joint failure, ensuring robust connections.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density packaging, allowing for more functionality in a smaller footprint, ideal for compact devices.

Maximum Supply Voltage (Vsup): 3.6 V

With a high maximum supply voltage, this IC can handle power fluctuations without compromising performance, ensuring operational stability.

Technical Specifications

Other Function Consumer ICs VSP2212Y/2M attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7.2 mm

Trade Compliance

VSP2212Y/2M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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