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VSP2210Y/2KG4

Texas Instruments

VSP2210Y/2KG4 by Texas Instruments

VSP2210Y/2KG4 by Texas Instruments is a 48-terminal consumer IC with CMOS technology. It operates b/w -25°C to 85°C, suitable for various consumer circuit applications. The package style is flatpack, low profile, fine pitch with gull wing terminals and a terminal pitch of 0.5mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,196

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-

-

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Digiode

USA . 1,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,738

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,248 parts In-Stock

1+ parts

$2.732

100+ parts

-

1k+ parts

$3.214

10k+ parts

-

2,248

$2.732

-

$3.214

-

ChromeModa Solutions

Germany . 5,037 parts In-Stock

1+ parts

$3.070

100+ parts

$2.517

1k+ parts

-

10k+ parts

-

5,037

$3.070

$2.517

-

-

IDEA Electronic Components Group

UK . 360 parts In-Stock

1+ parts

$3.070

100+ parts

-

1k+ parts

$2.763

10k+ parts

-

360

$3.070

-

$2.763

-

AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$7.742

100+ parts

-

1k+ parts

-

10k+ parts

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456

$7.742

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-

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One Stop Electronics

USA . 1,450 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

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10k+ parts

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1,450

$18.800

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-

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Corphita

USA . 3,833 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,833

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DigiPath Technology Company

USA . 1,434 parts In-Stock

1+ parts

-

100+ parts

$2.768

1k+ parts

-

10k+ parts

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1,434

-

$2.768

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Microchip USA

USA . 270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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270

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Overview

Elevate your consumer electronic designs with the VSP2210Y/2KG4 by Texas Instruments. Designed with precision and quality in mind, this consumer IC offers unparalleled performance and reliability. With a sleek flatpack, low profile package style and cutting-edge CMOS technology, this product is versatile and ideal for a wide range of applications. Whether you're working on smartphones, smart home devices, or wearables, the VSP2210Y/2KG4 provides the value, benefits, and advantages you need to bring your designs to life. Trust in Texas Instruments for superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal circuitry, making the product long-lasting and reliable.

Surface Mount: YES

Being surface mountable allows for easy installation on printed circuit boards, saving space and enabling efficient production processes.

Package Shape: SQUARE

The square shape makes the product easy to handle and fit into compact electronic devices.

Minimum Operating Temperature: -25 °C

The wide temperature range enables the product to operate in various environments, ensuring versatility and performance in different conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in signal processing.

Technical Specifications

Other Function Consumer ICs VSP2210Y/2KG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VSP2210Y/2KG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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