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VSP2000

Texas Instruments

VSP2000 by Texas Instruments

VSP2000 by Texas Instruments is a 48-terminal consumer IC with CMOS technology. It operates b/w -40°C to 85°C, suitable for industrial applications. The package is a square-shaped flatpack made of plastic/epoxy, designed for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,990 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,990

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-

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Digiode

USA . 1,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,662

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,024 parts In-Stock

1+ parts

$2.695

100+ parts

-

1k+ parts

$3.177

10k+ parts

-

2,024

$2.695

-

$3.177

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ChromeModa Solutions

Germany . 6,943 parts In-Stock

1+ parts

$3.028

100+ parts

$2.483

1k+ parts

-

10k+ parts

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6,943

$3.028

$2.483

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IDEA Electronic Components Group

UK . 907 parts In-Stock

1+ parts

$3.028

100+ parts

-

1k+ parts

$2.725

10k+ parts

-

907

$3.028

-

$2.725

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AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$15.767

100+ parts

-

1k+ parts

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10k+ parts

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838

$15.767

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One Stop Electronics

USA . 2,179 parts In-Stock

1+ parts

$21.800

100+ parts

-

1k+ parts

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10k+ parts

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2,179

$21.800

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Corphita

USA . 1,882 parts In-Stock

1+ parts

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100+ parts

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1,882

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DigiPath Technology Company

USA . 1,546 parts In-Stock

1+ parts

-

100+ parts

$2.730

1k+ parts

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10k+ parts

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1,546

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$2.730

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Overview

Elevate your consumer electronics with the cutting-edge VSP2000 by Texas Instruments. Designed with top-notch materials and advanced technology, this versatile IC offers unparalleled performance and reliability for a wide range of applications. From smart home devices to automotive systems, the VSP2000 delivers exceptional value, efficiency, and innovation. Trust in Texas Instruments' reputation for excellence and unlock endless possibilities with the VSP2000.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and insulation for the IC, ensuring long-lasting performance.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and making assembly simpler.

Package Shape: SQUARE

Square package shape is versatile and can fit well in various electronic devices and applications.

No. of Terminals: 48

Having 48 terminals provides flexibility and connectivity options for different circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance and stability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function effectively even in extreme cold conditions.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement makes the IC energy-efficient and suitable for low-power applications.

Maximum Supply Voltage (Vsup): 3.3 V

Moderate maximum supply voltage ensures safe operation and protection against overvoltage scenarios.

Technical Specifications

Other Function Consumer ICs VSP2000 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

VSP2000 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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