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VSP2212Y/2K

Texas Instruments

VSP2212Y/2K by Texas Instruments

VSP2212Y/2K by Texas Instruments is a consumer IC with 48 terminals in a square package. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.6V. Ideal for applications requiring low profile and fine pitch technology, such as consumer circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,901 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,901

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Vyrian

USA . 2,956 parts In-Stock

1+ parts

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2,956

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,095 parts In-Stock

1+ parts

$1.814

100+ parts

-

1k+ parts

$2.369

10k+ parts

-

1,095

$1.814

-

$2.369

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DigiPath Technology Company

USA . 1,318 parts In-Stock

1+ parts

$1.997

100+ parts

-

1k+ parts

-

10k+ parts

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1,318

$1.997

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-

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ChromeModa Solutions

Germany . 956 parts In-Stock

1+ parts

$2.038

100+ parts

$1.671

1k+ parts

-

10k+ parts

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956

$2.038

$1.671

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IDEA Electronic Components Group

UK . 720 parts In-Stock

1+ parts

$2.038

100+ parts

-

1k+ parts

$1.834

10k+ parts

-

720

$2.038

-

$1.834

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AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$5.347

100+ parts

-

1k+ parts

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10k+ parts

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778

$5.347

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One Stop Electronics

USA . 825 parts In-Stock

1+ parts

$8.800

100+ parts

-

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825

$8.800

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Corphita

USA . 2,166 parts In-Stock

1+ parts

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2,166

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Microchip USA

USA . 498 parts In-Stock

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498

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Overview

Unlock the potential of your consumer electronics with the VSP2212Y/2K by Texas Instruments. Designed with precision and quality in mind, this versatile IC offers a wide range of applications in various devices. From smart home technology to portable gadgets, this product delivers exceptional performance and reliability. With Texas Instruments' renowned reputation for innovation and excellence, you can trust that the VSP2212Y/2K provides unmatched value and benefits to enhance your products. Experience the difference today and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mounting allows for easy integration into circuit boards, saving space and ensuring efficient assembly processes.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, optimizing layout design and overall system performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions without compromising its functionality.

Minimum Operating Temperature: -25 °C

The wide temperature range from -25°C to 85°C makes this IC suitable for a variety of applications, including those in extreme cold or hot environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable for consumer electronics.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage allows for operation in low-power applications, helping to conserve energy and extend battery life.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage provides flexibility in power supply options, accommodating different voltage requirements for consumer devices.

Technical Specifications

Other Function Consumer ICs VSP2212Y/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP2212Y/2K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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