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TMDS261BPAG

Texas Instruments

TMDS261BPAG by Texas Instruments

TMDS261BPAG by Texas Instruments is a 64-terminal IC with 2 channels, operating at 3.3V. It features a thin profile flatpack package suitable for consumer circuits, with a max temperature of 70°C. Ideal for applications requiring high-performance and compact design in commercial-grade environments.

Median Price

$2.599

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

1+ parts

$2.054

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$2.054

-

-

-

Texas Instruments

USA . 13,559 parts In-Stock

1+ parts

$3.000

100+ parts

$2.628

1k+ parts

$1.485

10k+ parts

-

13,559

$3.000

$2.628

$1.485

-

Mouser Electronics

USA . 52 parts In-Stock

1+ parts

$4.250

100+ parts

$2.610

1k+ parts

$2.430

10k+ parts

$2.280

52

$4.250

$2.610

$2.430

$2.280

Rochester

USA . 1,045 parts In-Stock

1+ parts

-

100+ parts

$2.140

1k+ parts

$1.910

10k+ parts

$1.800

1,045

-

$2.140

$1.910

$1.800

DigiKey

USA . 1,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.810

10k+ parts

-

1,045

-

-

$2.810

-

Verical

USA . 895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.388

10k+ parts

$2.250

895

-

-

$2.388

$2.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 375 parts In-Stock

1+ parts

$0.820

100+ parts

-

1k+ parts

-

10k+ parts

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375

$0.820

-

-

-

Vyrian

USA . 3,004 parts In-Stock

1+ parts

$0.863

100+ parts

-

1k+ parts

-

10k+ parts

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3,004

$0.863

-

-

-

DigiKey Marketplace

USA . 1,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,045

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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800

-

-

-

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Dan-Mar Components

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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800

-

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Cyclops Electronics Ltd

UK . 263 parts In-Stock

1+ parts

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263

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Inventory MP

USA . 24 parts In-Stock

1+ parts

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24

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Bristol Electronics

USA . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 262 parts In-Stock

1+ parts

$0.777

100+ parts

-

1k+ parts

-

10k+ parts

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262

$0.777

-

-

-

Parana Technologies

USA . 308 parts In-Stock

1+ parts

$1.867

100+ parts

-

1k+ parts

$2.414

10k+ parts

-

308

$1.867

-

$2.414

-

DigiPath Technology Company

USA . 967 parts In-Stock

1+ parts

$2.056

100+ parts

$1.892

1k+ parts

-

10k+ parts

-

967

$2.056

$1.892

-

-

ChromeModa Solutions

Germany . 4,815 parts In-Stock

1+ parts

$2.098

100+ parts

$1.720

1k+ parts

-

10k+ parts

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4,815

$2.098

$1.720

-

-

IDEA Electronic Components Group

UK . 494 parts In-Stock

1+ parts

$2.098

100+ parts

-

1k+ parts

$1.888

10k+ parts

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494

$2.098

-

$1.888

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QUARKTWIN TECHNOLOGY LTD

USA . 14,526 parts In-Stock

1+ parts

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14,526

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Lixinc

USA . 14,071 parts In-Stock

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14,071

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A-Z Elektronik GmbH

Germany . 5,289 parts In-Stock

1+ parts

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5,289

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

-

-

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Metaverse IC Inc.

Canada . 170 parts In-Stock

1+ parts

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170

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Kepictronics

USA . 56 parts In-Stock

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56

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Overview

Elevate your consumer electronic designs with the TMDS261BPAG by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers quality and reliability with every product. This versatile IC caters to various applications in the consumer electronics industry, offering unmatched value and benefits to customers. Trust in Texas Instruments to provide cutting-edge solutions that meet your design needs and exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Power Supplies (V): 3.3

Operates at a standard power supply voltage of 3.3V, suitable for many applications.

No. of Terminals: 64

The high number of terminals provides flexibility for connecting to various components.

Maximum Operating Temperature: 70 °C

Can operate efficiently at a relatively high temperature of 70°C.

Minimum Operating Temperature: 0 °C

Can function at low temperatures down to 0°C, suitable for various environments.

Maximum Seated Height: 1.2 mm

Low seated height allows for a compact design and space-saving in applications.

Width: 10 mm

Compact width size enables integration in small spaces or crowded PCB layouts.

Minimum Supply Voltage (Vsup): 3 V

Works within a range of supply voltage starting from 3V, compatible with common power sources.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperatures up to 260°C during assembly processes.

Technical Specifications

Other Function Consumer ICs TMDS261BPAG attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

216 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TMDS261BPAG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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