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TMDS261PAGR

Texas Instruments

TMDS261PAGR by Texas Instruments

TMDS261PAGR by Texas Instruments is a consumer IC with 64 terminals in a square package. It operates b/w 0-70°C, with supply voltage ranging from 3-3.6V. Ideal for applications requiring fine pitch and thin profile packages in commercial temperature grade environments.

Median Price

$1.725

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 120,000 parts In-Stock

1+ parts

-

100+ parts

$1.540

1k+ parts

$1.380

10k+ parts

$1.300

120,000

-

$1.540

$1.380

$1.300

Verical

USA . 109,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.725

10k+ parts

$1.625

109,500

-

-

$1.725

$1.625

DigiKey

USA . 81,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.780

10k+ parts

-

81,000

-

-

$1.780

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,416 parts In-Stock

1+ parts

$1.624

100+ parts

-

1k+ parts

-

10k+ parts

-

2,416

$1.624

-

-

-

Vyrian

USA . 1,762 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,762

$1.710

-

-

-

DigiKey Marketplace

USA . 120,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 404 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$1.539

-

-

-

Parana Technologies

USA . 1,964 parts In-Stock

1+ parts

$1.788

100+ parts

-

1k+ parts

$2.349

10k+ parts

-

1,964

$1.788

-

$2.349

-

DigiPath Technology Company

USA . 542 parts In-Stock

1+ parts

$1.969

100+ parts

-

1k+ parts

-

10k+ parts

-

542

$1.969

-

-

-

ChromeModa Solutions

Germany . 6,198 parts In-Stock

1+ parts

$2.009

100+ parts

$1.647

1k+ parts

-

10k+ parts

-

6,198

$2.009

$1.647

-

-

IDEA Electronic Components Group

UK . 2,221 parts In-Stock

1+ parts

$2.009

100+ parts

-

1k+ parts

$1.808

10k+ parts

-

2,221

$2.009

-

$1.808

-

A-Z Elektronik GmbH

Germany . 4,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,605

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

Microchip USA

USA . 465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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465

-

-

-

-

Kepictronics

USA . 118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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118

-

-

-

-

Overview

Elevate your consumer electronic designs with the TMDS261PAGR by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unmatched reliability and performance in various applications. From smart home devices to wearable technology, this consumer circuit IC delivers exceptional value, efficiency, and versatility. Trust Texas Instruments to provide innovative solutions that meet your unique needs. Experience the difference with the TMDS261PAGR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, ensuring reliability in various applications.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Allows for compact and space-efficient placement on the circuit board.

Maximum Operating Temperature: 70 °C

Ensures stable performance even in high-temperature environments.

Minimum Supply Voltage (Vsup): 3 V

Supports a wide range of applications requiring low voltage operation.

Technical Specifications

Other Function Consumer ICs TMDS261PAGR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TMDS261PAGR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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