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TMDS361APAGR

Texas Instruments

TMDS361APAGR by Texas Instruments

Other Consumer ICs; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,080 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,080

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Digiode

USA . 3,117 parts In-Stock

1+ parts

-

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-

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3,117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,363 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

$2.397

10k+ parts

-

1,363

$1.850

-

$2.397

-

DigiPath Technology Company

USA . 2,270 parts In-Stock

1+ parts

$2.037

100+ parts

$1.874

1k+ parts

-

10k+ parts

-

2,270

$2.037

$1.874

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ChromeModa Solutions

Germany . 5,932 parts In-Stock

1+ parts

$2.079

100+ parts

$1.705

1k+ parts

-

10k+ parts

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5,932

$2.079

$1.705

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IDEA Electronic Components Group

UK . 1,168 parts In-Stock

1+ parts

$2.079

100+ parts

-

1k+ parts

$1.871

10k+ parts

-

1,168

$2.079

-

$1.871

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One Stop Electronics

USA . 423 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

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10k+ parts

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423

$8.800

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AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$16.525

100+ parts

-

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10k+ parts

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773

$16.525

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GreenTree Electronics

Israel . 12,440 parts In-Stock

1+ parts

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12,440

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Lixinc

USA . 7,070 parts In-Stock

1+ parts

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7,070

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Kepictronics

USA . 5,987 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,987

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Corphita

USA . 2,358 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,358

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Technical Specifications

Other Function Consumer ICs TMDS361APAGR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TMDS361APAGR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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