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E-TDA7406

STMicroelectronics

E-TDA7406 by STMicroelectronics

E-TDA7406 by STMicroelectronics is a low-profile consumer IC designed for industrial applications. It operates b/w 7.5V and 10V, with a max temp of 85 °C and features a compact 10mm x 10mm square package. Ideal for surface mount designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,009 parts In-Stock

1+ parts

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3,009

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Digiode

USA . 1,393 parts In-Stock

1+ parts

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1,393

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Anansix

USA . 307 parts In-Stock

1+ parts

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307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 273 parts In-Stock

1+ parts

$0.372

100+ parts

-

1k+ parts

-

10k+ parts

$0.357

273

$0.372

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-

$0.357

Northwest PG Solutions

USA . 772 parts In-Stock

1+ parts

$0.409

100+ parts

-

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$0.361

772

$0.409

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$0.361

IDEA Electronic Components Group

UK . 26 parts In-Stock

1+ parts

$2.358

100+ parts

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$2.122

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26

$2.358

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$2.122

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MKK Technologies

India . 259 parts In-Stock

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$4.434

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259

$4.434

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DigiPath Technology Company

USA . 259 parts In-Stock

1+ parts

$4.434

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259

$4.434

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Corphita

USA . 2,749 parts In-Stock

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2,749

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Parana Technologies

USA . 1,951 parts In-Stock

1+ parts

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$2.819

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1,951

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$2.819

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Overview

Unlock the potential of your consumer electronics with the E-TDA7406 from STMicroelectronics—a trusted leader in innovative technology. This high-quality IC offers exceptional performance for audio applications, ensuring crystal-clear sound and reliability across diverse environments. With its low-profile design and robust temperature range, the E-TDA7406 enhances your devices' efficiency while simplifying integration. Experience superior value and peace of mind with STMicroelectronics' reputation for excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs, saving valuable PCB space.

Package Shape: SQUARE

The square package shape contributes to a symmetrical layout, improving thermal management and signal integrity.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it is designed with features ideal for consumer electronics, ensuring high performance in everyday applications.

Power Supplies (V): 9

Operating at 9V makes it versatile for standard applications that require a common power supply, facilitating ease of use in various designs.

No. of Terminals: 44

With 44 terminals, this IC offers ample connectivity options for complex circuit integration, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style allows for compact designs, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

Having a maximum operating temperature of 85 °C ensures reliable performance in environments subject to heat.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes it suitable for industrial and outdoor applications where temperature extremes may occur.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and prevents oxidation, ensuring a reliable long-term connection.

Terminal Position: QUAD

The quad terminal positioning aids in efficient and stable mounting, contributing to reliable mechanical connections.

Maximum Seated Height: 1.6 mm

With a maximum seated height of just 1.6 mm, it is well-suited for low-profile applications that need to minimize overall height.

Width: 10 mm

A width of 10 mm makes it suitable for compact layouts without sacrificing performance.

Minimum Supply Voltage (Vsup): 7.5 V

The ability to operate with a minimum supply voltage of 7.5V allows it to be used in a variety of systems that require lower power.

Maximum Time At Peak Reflow Temperature (s): 40

A max reflow time of 40 seconds is suitable for efficient manufacturing processes, minimizing potential thermal damage.

Peak Reflow Temperature °C: 260

Withstanding a peak reflow temperature of 260 °C means it can endure typical soldering processes, ensuring reliability during assembly.

Length: 10 mm

The 10 mm length contributes to a balanced footprint, complementing its width for neat designs on PCBs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures ensures reliability and performance, making it suitable for harsh conditions.

Terminal Form: GULL WING

Gull wing terminal forms increase mechanical stability and facilitate better solder joint visibility, enhancing assembly quality.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for compact connections while maintaining ease of soldering during assembly.

Maximum Supply Voltage (Vsup): 10 V

The capability to handle up to 10V maximizes its versatility in different circuit designs requiring various voltage levels.

Technical Specifications

Other Function Consumer ICs E-TDA7406 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3/e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

E-TDA7406 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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