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TRF7961RHBTG4

Texas Instruments

TRF7961RHBTG4 by Texas Instruments

TRF7961RHBTG4 by Texas Instruments is a CONSUMER CIRCUIT IC with PLASTIC/EPOXY package, suitable for industrial use. It operates b/w -40 to 110°C, with peak reflow temperature of 260°C. This SQUARE chip carrier has a very thin profile and nickel palladium gold terminal finish, making it ideal for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,343 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,343

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Digiode

USA . 3,792 parts In-Stock

1+ parts

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1k+ parts

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3,792

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,046 parts In-Stock

1+ parts

$3.274

100+ parts

-

1k+ parts

$3.800

10k+ parts

-

1,046

$3.274

-

$3.800

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DigiPath Technology Company

USA . 473 parts In-Stock

1+ parts

$3.605

100+ parts

$3.317

1k+ parts

-

10k+ parts

-

473

$3.605

$3.317

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ChromeModa Solutions

Germany . 6,793 parts In-Stock

1+ parts

$3.679

100+ parts

$3.017

1k+ parts

-

10k+ parts

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6,793

$3.679

$3.017

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IDEA Electronic Components Group

UK . 2,045 parts In-Stock

1+ parts

$3.679

100+ parts

-

1k+ parts

$3.311

10k+ parts

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2,045

$3.679

-

$3.311

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AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$6.139

100+ parts

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10k+ parts

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548

$6.139

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One Stop Electronics

USA . 496 parts In-Stock

1+ parts

$7.800

100+ parts

-

1k+ parts

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496

$7.800

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Corphita

USA . 1,782 parts In-Stock

1+ parts

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100+ parts

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1,782

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Overview

Elevate your consumer electronics with the TRF7961RHBTG4 by Texas Instruments, a cutting-edge consumer circuit designed to enhance functionality and performance. Crafted with precision and quality in mind, this IC boasts a heat sink/slug package style for optimal thermal management. Ideal for a wide range of applications, from smart home devices to wearables, this chip carrier offers industrial-grade reliability and a very thin profile for seamless integration. Experience the value and benefits of Texas Instruments' expertise in semiconductor technology with the TRF7961RHBTG4. Elevate your products to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy makes the product lightweight and durable, ideal for consumer devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto PCBs, saving time and cost during production.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the circuit board.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, the product can withstand rigorous usage conditions without overheating.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures the product can function in various environments, including extreme cold.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Width: 5 mm

The compact width of 5mm allows for a space-efficient design, ideal for small consumer devices.

Length: 5 mm

The short length of 5mm contributes to the compact size of the product, fitting into tight spaces on the PCB.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, the product enables high-density mounting on the circuit board for increased functionality.

Moisture Sensitivity Level (MSL): 2

The MSL level of 2 indicates the product is moderately sensitive to moisture, requiring standard precautions during storage and handling.

Technical Specifications

Other Function Consumer ICs TRF7961RHBTG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TRF7961RHBTG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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