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TRF7961RHBRG4

Texas Instruments

TRF7961RHBRG4 by Texas Instruments

TRF7961RHBRG4 by Texas Instruments is a CONSUMER CIRCUIT IC with PLASTIC/EPOXY body, suitable for industrial use. It operates b/w -40 to 110°C, has a terminal pitch of 0.5mm, and measures 5x5mm in size. Ideal for applications requiring very thin profile chips in surface mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,862 parts In-Stock

1+ parts

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Chip Stock

USA . 4,000 parts In-Stock

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Digiode

USA . 3,231 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,796 parts In-Stock

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$2.049

100+ parts

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$2.570

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$2.049

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$2.570

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DigiPath Technology Company

USA . 855 parts In-Stock

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$2.256

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$2.075

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855

$2.256

$2.075

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IDEA Electronic Components Group

UK . 2,324 parts In-Stock

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$2.302

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$2.072

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$2.302

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$2.072

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ChromeModa Solutions

Germany . 376 parts In-Stock

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$2.302

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$1.888

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376

$2.302

$1.888

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AZTECH Wire

Italy . 352 parts In-Stock

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$6.627

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$6.627

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One Stop Electronics

USA . 1,295 parts In-Stock

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$7.800

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$7.800

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Lixinc

USA . 16,786 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,863 parts In-Stock

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Overview

Experience cutting-edge technology with the TRF7961RHBRG4 by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers once again with this consumer circuit IC. Perfect for a wide range of applications, this chip carrier boasts a very thin profile and maximum operating temperature of 110C, making it ideal for industrial use. With nickel palladium gold terminal finish and a moisture sensitivity level of 2, this product offers unbeatable value and performance. Upgrade your electronics with the TRF7961RHBRG4 and discover the difference Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and flexibility for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Package Shape: SQUARE

Square package shape helps in efficient use of space on a circuit board.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures stability and reliability in various conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh operating conditions.

Technical Specifications

Other Function Consumer ICs TRF7961RHBRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TRF7961RHBRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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