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TRF7900APWG4

Texas Instruments

TRF7900APWG4 by Texas Instruments

TRF7900APWG4 by Texas Instruments is a small outline IC with 28 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 4-5.5V and peak reflow temp of 260°C. Ideal for consumer circuits in industrial applications due to its compact size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,398

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-

-

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Digiode

USA . 2,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,189

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,220 parts In-Stock

1+ parts

$0.661

100+ parts

-

1k+ parts

$1.715

10k+ parts

-

1,220

$0.661

-

$1.715

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DigiPath Technology Company

USA . 1,326 parts In-Stock

1+ parts

$0.728

100+ parts

-

1k+ parts

-

10k+ parts

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1,326

$0.728

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ChromeModa Solutions

Germany . 4,038 parts In-Stock

1+ parts

$0.743

100+ parts

$0.609

1k+ parts

-

10k+ parts

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4,038

$0.743

$0.609

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IDEA Electronic Components Group

UK . 224 parts In-Stock

1+ parts

$0.743

100+ parts

-

1k+ parts

$0.669

10k+ parts

-

224

$0.743

-

$0.669

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$3.880

100+ parts

$3.531

1k+ parts

$3.182

10k+ parts

-

10

$3.880

$3.531

$3.182

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$7.450

100+ parts

-

1k+ parts

-

10k+ parts

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368

$7.450

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One Stop Electronics

USA . 863 parts In-Stock

1+ parts

$20.800

100+ parts

-

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863

$20.800

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Corphita

USA . 4,858 parts In-Stock

1+ parts

-

100+ parts

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4,858

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Overview

Elevate your consumer electronics with the TRF7900APWG4 by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments has crafted this cutting-edge IC to deliver superior performance in a compact package. Whether you're designing smart home devices, wearable technology, or IoT solutions, this versatile component offers unparalleled value and efficiency. Experience seamless integration, enhanced functionality, and innovative design possibilities with the TRF7900APWG4. Choose Texas Instruments for your next project and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for consumer electronic products due to its lightweight and cost-effective nature.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, making this product suitable for mass production.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and can be easily integrated into various electronic devices.

No. of Terminals: 28

Having a sufficient number of terminals allows for more connectivity options and functionality in the circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in both extreme cold and hot environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, enhancing the product's durability and reliability.

Width: 4.4 mm

The compact width makes this product suitable for applications where space is limited.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs.

Technical Specifications

Other Function Consumer ICs TRF7900APWG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TRF7900APWG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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