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TLV990-28PFBG4

Texas Instruments

TLV990-28PFBG4 by Texas Instruments

TLV990-28PFBG4 by Texas Instruments is a consumer IC with 48 terminals in a square flatpack package. Operating temperature range from -20 to 75°C, suitable for commercial extended applications. Features include CMOS technology, 2.7-3.3V supply voltage, and nickel palladium gold terminal finish for robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,432 parts In-Stock

1+ parts

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7,432

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Digiode

USA . 2,720 parts In-Stock

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2,720

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 392 parts In-Stock

1+ parts

$1.977

100+ parts

-

1k+ parts

$2.507

10k+ parts

-

392

$1.977

-

$2.507

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DigiPath Technology Company

USA . 67 parts In-Stock

1+ parts

$2.177

100+ parts

-

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67

$2.177

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ChromeModa Solutions

Germany . 2,871 parts In-Stock

1+ parts

$2.221

100+ parts

$1.821

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-

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2,871

$2.221

$1.821

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IDEA Electronic Components Group

UK . 1,617 parts In-Stock

1+ parts

$2.221

100+ parts

-

1k+ parts

$1.999

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1,617

$2.221

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$1.999

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One Stop Electronics

USA . 1,051 parts In-Stock

1+ parts

$8.800

100+ parts

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1,051

$8.800

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AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$15.353

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231

$15.353

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Corphita

USA . 260 parts In-Stock

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260

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Overview

Unlock the full potential of your consumer electronics with the TLV990-28PFBG4 by Texas Instruments. This innovative IC offers unmatched quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications in consumer circuits, this IC delivers superior performance in a compact and durable package. Experience the value and benefits of Texas Instruments technology with the TLV990-28PFBG4, designed to elevate your electronic devices to new heights of efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight, durable, and resistant to impact, making the product suitable for various consumer applications.

Surface Mount: YES

Surface mount technology makes the product easy to integrate onto PCBs, saving space and simplifying assembly processes.

Maximum Operating Temperature: 75 °C

With a high operating temperature range, the product can withstand demanding thermal conditions, ensuring reliability in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for consumer applications.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement allows the product to operate efficiently even with limited power sources, increasing its versatility.

Technical Specifications

Other Function Consumer ICs TLV990-28PFBG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLV990-28PFBG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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