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E7111-0-102A19-BPG

Onsemi

E7111-0-102A19-BPG by Onsemi

E7111-0-102A19-BPG by Onsemi is a consumer circuit IC with 19 terminals in a rectangular grid array package. It operates b/w -40 to 85 °C, with a min supply voltage of 1.05V and max of 2V. Ideal for industrial applications requiring compact design and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,835 parts In-Stock

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Vyrian

USA . 992 parts In-Stock

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992

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Distributors (Availability)

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Native Components

USA . 345 parts In-Stock

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$0.685

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345

$0.685

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Northwest PG Solutions

USA . 771 parts In-Stock

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$0.754

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771

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SupplyDigital Components

Austria . 8,282 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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TANS Electronics

Latvia . 4,059 parts In-Stock

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Kulean Microsystems

USA . 1,748 parts In-Stock

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1,748

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Corphita

USA . 1,188 parts In-Stock

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Problanco Electronics

Mexico . 1,029 parts In-Stock

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UHIMA Technologies

Türkiye . 544 parts In-Stock

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544

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Perfect Parts

USA . 248 parts In-Stock

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Corohmni

South Africa . 169 parts In-Stock

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169

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unleash the power of innovation with the E7111-0-102A19-BPG by Onsemi. This cutting-edge consumer circuit IC is designed to maximize performance and reliability, making it ideal for a wide range of applications. With a package style of grid array and a compact rectangular shape, this IC offers ease of installation and compatibility with various devices. From its high-quality plastic/epoxy body material to its industrial-grade temperature rating, this product delivers unmatched value and efficiency. Elevate your projects with the E7111-0-102A19-BPG and experience unparalleled quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring long-lasting performance.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly onto PCBs, making this IC suitable for mass production.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions, ensuring reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows this IC to function in both extreme cold and hot environments.

Width: 2.9 mm

The small width makes this IC suitable for applications where space is limited.

Terminal Pitch: 0.625 mm

The fine terminal pitch allows for high-density mounting, making this IC suitable for compact PCB designs.

Technical Specifications

Other Function Consumer ICs E7111-0-102A19-BPG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B19

Length:

5.25 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

19

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

LGA19,3X8,25/34

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.525 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.05 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.625 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.9 mm

Trade Compliance

E7111-0-102A19-BPG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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