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TCI6638K2KDAAWA24

Texas Instruments

TCI6638K2KDAAWA24 by Texas Instruments

TCI6638K2KDAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w supply voltages of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style. Ideal for applications requiring high processing power in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,878 parts In-Stock

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3,878

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Vyrian

USA . 3,084 parts In-Stock

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3,084

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,556 parts In-Stock

1+ parts

$6.000

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1,556

$6.000

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AZTECH Wire

Italy . 404 parts In-Stock

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$10.496

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404

$10.496

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Parana Technologies

USA . 1,208 parts In-Stock

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$13.339

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$13.852

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1,208

$13.339

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$13.852

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IDEA Electronic Components Group

UK . 590 parts In-Stock

1+ parts

$14.988

100+ parts

$14.239

1k+ parts

$13.489

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590

$14.988

$14.239

$13.489

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ChromeModa Solutions

Germany . 368 parts In-Stock

1+ parts

$14.988

100+ parts

$12.290

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368

$14.988

$12.290

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Corohmni

South Africa . 1,879 parts In-Stock

1+ parts

$46.342

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1,879

$46.342

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Corphita

USA . 2,606 parts In-Stock

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DigiPath Technology Company

USA . 1,440 parts In-Stock

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$13.513

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1,440

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$13.513

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Overview

Unlock the power of cutting-edge technology with the TCI6638K2KDAAWA24 by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers a top-of-the-line product in the category of Other Function uPs, uCs & Peripheral ICs. This versatile microprocessor circuit offers unmatched performance and reliability, making it ideal for a wide range of applications. From consumer electronics to industrial automation, this product provides exceptional value, benefits, and advantages to customers seeking top-notch solutions for their projects. Experience the difference with Texas Instruments and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient assembly on circuit boards, saving time and increasing productivity during manufacturing.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage ensures reliable performance and stable operation under varying power conditions, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, enabling compact and streamlined designs in electronic devices.

No. of Terminals: 1517

With a large number of terminals, this product offers extensive connectivity options and compatibility with various other components, increasing flexibility in circuit design.

Package Style (Meter): GRID ARRAY

The grid array package style provides a sturdy and secure connection between the chip and the board, reducing the risk of damage or disconnection in high-vibration environments.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for efficient power consumption and extends the battery life of electronic devices, making it energy-efficient.

Terminal Finish: TIN SILVER COPPER

The use of multiple terminal finishes enhances the conductivity and reliability of the connections, ensuring stable performance and reducing the risk of signal loss or interference.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and improves thermal dissipation, enhancing overall performance and reliability in various operating conditions.

Maximum Seated Height: 3.75 mm

The low maximum seated height allows for slim and compact designs in electronic devices, saving space and enabling sleek and modern product aesthetics.

Width: 40 mm

The moderate width of the product ensures compatibility with standard circuit board sizes, making it easier to integrate into existing electronic systems and designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum reflow time at peak temperature ensures fast and efficient manufacturing processes, reducing production costs and increasing output.

Peak Reflow Temperature °C: 245

The high peak reflow temperature capability allows for reliable soldering and bonding processes, ensuring strong and durable connections for long-term use.

Length: 40 mm

The moderate length of the product ensures compatibility with standard circuit board sizes, making it easier to integrate into existing electronic systems and designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC type enhances the processing power and capabilities of the product, enabling advanced functionality and performance in electronic devices.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating environments.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection between the chip and the board, ensuring stable performance and reducing the risk of signal loss or disconnection.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V provides a stable power source for the product, ensuring consistent and reliable operation in electronic devices with varying power requirements.

Terminal Pitch: 1 mm

The small terminal pitch allows for high-density integration on circuit boards, enabling compact and space-efficient designs in electronic devices with limited space.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the product is suitable for standard handling and storage conditions, ensuring long-term reliability and performance in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6638K2KDAAWA24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6638K2KDAAWA24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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