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XC7Z045-1FFG900C

Xilinx

XC7Z045-1FFG900C by Xilinx

XC7Z045-1FFG900C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 900 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.

Median Price

$2,072.010

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Overview

Unleash the power of innovation with the XC7Z045-1FFG900C by Xilinx. As a leader in the industry, Xilinx delivers top-notch quality and reliability in their products. This versatile System on Chip is perfect for a wide range of applications, offering unmatched performance and efficiency. Say hello to seamless integration and enhanced functionality with this cutting-edge product. Upgrade your technology game with Xilinx and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the product, making it resistant to environmental factors.

Surface Mount: YES

Being surface mountable allows for easy and quick installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage capability ensures stable and reliable performance under various operating conditions.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the circuit board, making it suitable for compact designs.

No. of Terminals: 900

With a high number of terminals, this product offers versatile connectivity options, enabling complex circuit configurations.

Package Style (Meter): GRID ARRAY

The grid array package style enhances thermal performance and electrical connectivity, ensuring efficient operation of the product.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement enables energy-efficient operation, reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions or high-temperature applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments or during startup conditions.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the circuit board layout and offers easy access for soldering or connection.

Maximum Seated Height: 3.24 mm

The low maximum seated height profile enables the product to be used in slim and compact designs without compromising on performance.

Width: 27 mm

The moderate width dimension makes it compatible with standard PCB layouts, ensuring seamless integration into various electronic systems.

Length: 27 mm

The moderate length dimension offers a balanced form factor, making it suitable for a wide range of applications without space constraints.

Peripheral IC Type: SYSTEM ON CHIP

The integration of system-on-chip functionality provides a comprehensive solution within a single IC, reducing component count and improving system efficiency.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BALL

The ball terminal form facilitates reliable solder connections and ensures robust electrical contact, enhancing the overall durability of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage specification provides a reference for optimal operation, ensuring consistent and stable performance within the specified voltage range.

Terminal Pitch: 1 mm

The tight terminal pitch allows for high-density mounting on the PCB, enabling efficient use of available space and facilitating intricate circuit designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-1FFG900C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B900

Length:

27 mm

No. of Terminals:

900

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-1FFG900C Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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