Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XC7Z045-1FFG900C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 900 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.
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The use of plastic/epoxy material provides durability and protection to the product, making it resistant to environmental factors.
Being surface mountable allows for easy and quick installation on circuit boards, saving time and effort during manufacturing.
The high maximum supply voltage capability ensures stable and reliable performance under various operating conditions.
The square package shape helps in optimizing space utilization on the circuit board, making it suitable for compact designs.
With a high number of terminals, this product offers versatile connectivity options, enabling complex circuit configurations.
The grid array package style enhances thermal performance and electrical connectivity, ensuring efficient operation of the product.
The low minimum supply voltage requirement enables energy-efficient operation, reducing power consumption and heat generation.
The high maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions or high-temperature applications.
The low minimum operating temperature ensures reliable operation even in cold environments or during startup conditions.
Having terminals positioned at the bottom simplifies the circuit board layout and offers easy access for soldering or connection.
The low maximum seated height profile enables the product to be used in slim and compact designs without compromising on performance.
The moderate width dimension makes it compatible with standard PCB layouts, ensuring seamless integration into various electronic systems.
The moderate length dimension offers a balanced form factor, making it suitable for a wide range of applications without space constraints.
The integration of system-on-chip functionality provides a comprehensive solution within a single IC, reducing component count and improving system efficiency.
Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.
The ball terminal form facilitates reliable solder connections and ensures robust electrical contact, enhancing the overall durability of the product.
The nominal supply voltage specification provides a reference for optimal operation, ensuring consistent and stable performance within the specified voltage range.
The tight terminal pitch allows for high-density mounting on the PCB, enabling efficient use of available space and facilitating intricate circuit designs.
Other Function uPs,uCs & Peripheral ICs XC7Z045-1FFG900C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XC7Z045-1FFG900C Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev Material Chg 16/Dec/2019 Product Marking Chg 31/Oct/2016
PCN Packaging - Mult Devices 26/Jun/2017
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
MC7805CTG
Onsemi
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743IIT6
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rochester Electronics
Digitron Semiconductors
LM2931Z-5.0G
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
Db Lectro
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MMBT2907ALT1G
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
XCZU7EG-2FBVB900E
Xilinx
XCZU7EG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, with dimensions of 31mm x 31mm. Operating b/w 0 to 100 °C, it has a supply voltage range of 0.825V to 0.876V making it ideal for high-performance computing applications.
AR1100-I/SS
Microchip Technology
Microchip AR1100-I/SS is a CMOS microprocessor circuit with 20 terminals, operating at -40 to 85°C. It has a supply voltage range of 3.135V to 3.465V and is suitable for industrial applications requiring small outline, shrink pitch packages.
CC1312R1F3RGZT
Texas Instruments
The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.
M1A3P600L-1FGG144I
SoC; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
1433
Ndk America
Other uPs/uCs/Peripheral ICs;
AM6442BSEFHAALV
AM6442BSEFHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for high-speed applications requiring fine pitch components.
AX8052F143-3-TX30
AX8052F143-3-TX30 by Onsemi is a 40-terminal System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.8V to 3.6V. Ideal for industrial applications requiring a compact, low-profile chip carrier package style.
DA14531MOD-00F01002
Renesas Electronics
SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;
CY8C3866AXI-039T
Infineon Technologies
CY8C3866AXI-039T by Infineon is a 100-terminal, low-profile, fine-pitch FLATPACK IC with a CMOS technology and 524288 ROM bits. Operating at -40 to 85 °C, it has a supply voltage range of 1.71V to 5.5V making it ideal for industrial applications requiring a programmable SoC solution.
P82B715TD,118
NXP Semiconductors
NXP Semiconductors P82B715TD,118 is an 8-terminal IC with a supply voltage range of 4.5V to 12V. Ideal for industrial applications, it operates b/w -40°C to 85°C and features a small outline package style. This bipolar technology peripheral IC is designed for microprocessor circuits in various electronic devices.
FXLC95000CLR1
FXLC95000CLR1 by NXP Semiconductors is a CMOS microprocessor circuit with 24 terminals and a rectangular package shape. It operates at a min supply voltage of 1.71V and has an industrial temperature grade of -40 to 85°C. This peripheral IC is suitable for various applications requiring low voltage and compact size.
AM6231ATGGHAALW
AM6231ATGGHAALW by Texas Instruments is a CMOS SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration and low-profile design.
CSR8670C-IBBH-R
Qualcomm
Qualcomm's CSR8670C-IBBH-R is a CMOS microprocessor circuit with 112 terminals in a grid array package. It is surface-mountable and features ball terminal form. This IC is ideal for applications requiring high-performance processing in compact electronic devices.
MCIMX6Y1CVM05AB
MCIMX6Y1CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C, with supply voltage ranging from 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
SLB9670XQ2.0
SLB9670XQ2.0 by Infineon Technologies is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it suitable for secure authentication applications in various electronic devices. This chip carrier package with 32 terminals is surface mountable and has a compact size of 5mm x 5mm x 0.9mm, ideal for space-constrained designs.
CYAT827AZA59-3200A
PSoC;
PN7150B0HN/C11006Y
NXP Semiconductors PN7150B0HN/C11006Y is a NFC controller with 40 terminals, operating voltage range of 1.65V to 1.95V, and max temp of 85°C. Ideal for applications requiring low-profile chip carriers in surface-mount technology.
MCIMX6Q7CVT08AD
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
1436
Nihon Dempa Kogyo
MCP2221-I/SL
MCP2221-I/SL by Microchip: 3.3-5.5V supply, -40 to 85°C temp range, CMOS tech for industrial use. Small outline package with 14 terminals ideal for microprocessor circuits and peripherals. Matte tin finish, dual position terminals in a compact rectangular shape.
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XC7Z020-1CLG400I
The Xilinx XC7Z020-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z010-1CLG400C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
XC7Z020-2CLG484I
The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z020-1CLG484C
XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.
XC7Z030-1SBG485C
XC7Z030-1SBG485C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 485 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.
XC7Z020-1CLG484I
XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.
XC7Z020-2CLG400I
XC7Z020-2CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.
XC7Z010-1CLG400I
The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.
XC7Z020-1CLG400C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
XC7Z030-2FFG676I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
XC7Z020-L1CLG484I
XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.
XC7Z010-1CLG225I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
XC7Z010-2CLG400E
The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.
XC7Z010-2CLG400I
XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z030-1SBG485I
XC7Z030-1SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. With 485 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z007S-1CLG400C
The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z020-3CLG400E
The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z010-L1CLG400I
XC7Z010-L1CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. It operates b/w -40°C to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile, fine-pitch IC is ideal for applications requiring high-performance computing in compact spaces.
XC7Z015-2CLG485I
Xilinx XC7Z015-2CLG485I is a CMOS System on Chip with 485 terminals in a low profile grid array package. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.
XC7Z020-L1CLG400I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;
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