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XC7Z030-3FFG676E

Xilinx

XC7Z030-3FFG676E by Xilinx

The Xilinx XC7Z030-3FFG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

Median Price

$666.760

Lifecycle Status

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8

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Farnell

UK . 13 parts In-Stock

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$553.330

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Newark

USA . 10 parts In-Stock

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$666.760

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Element14

Singapore . 13 parts In-Stock

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Digiode

USA . 466 parts In-Stock

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$525.664

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VNN

France . 60 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Vyrian

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Chip Stock

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Modulus Dynamics

Lithuania . 1,479 parts In-Stock

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$15.270

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AZTECH Wire

Italy . 305 parts In-Stock

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$19.371

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Corohmni

South Africa . 291 parts In-Stock

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MARBEL Systems

Belgium . 120 parts In-Stock

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$78.365

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$75.916

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Texas Native Microelectronics

USA . 217 parts In-Stock

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$93.828

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$90.075

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$87.260

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Kenton Components

USA . 1,022 parts In-Stock

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$470.330

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Semicontronic

India . 10 parts In-Stock

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$470.330

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$458.572

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$456.220

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Corphita

USA . 326 parts In-Stock

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$497.997

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Vigor

Singapore . 644 parts In-Stock

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$499.200

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Continental Prestige Electronics

USA . 16 parts In-Stock

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$551.590

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Argo Parts USA

USA . 177 parts In-Stock

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$640.896

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$634.423

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$627.949

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Authorized Procurement Solutions

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Netroflash

USA . 2,000 parts In-Stock

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$640.768

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$621.153

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$608.076

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Supply Digital

USA . 1,416 parts In-Stock

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Qasali Group International

UK . 1,356 parts In-Stock

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RC Electronics

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Lixinc

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A-Z Elektronik GmbH

Germany . 557 parts In-Stock

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Perfect Parts

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S.R.D Solutions

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Overview

Experience the cutting-edge technology of the XC7Z030-3FFG676E by Xilinx, a top-tier manufacturer in the industry. This versatile system-on-chip offers unmatched quality and performance for a wide range of applications in the Other Function uPs, uCs & Peripheral ICs category. With a sleek package design and advanced CMOS technology, this product delivers exceptional value, benefits, and advantages to customers seeking reliability and efficiency in their projects. Upgrade your systems with the XC7Z030-3FFG676E and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and reliability, making this product a good choice for applications that require long-term performance.

Surface Mount: YES

Surface mount technology makes the installation process easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

This higher maximum supply voltage allows for greater flexibility in power requirements, accommodating a wider range of applications.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB, making it ideal for applications with limited board real estate.

Package Style (Meter): GRID ARRAY

The grid array package style provides excellent thermal performance and signal integrity, enhancing overall reliability of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is a common and stable voltage level, making the product compatible with a wide range of power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-3FFG676E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-3FFG676E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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