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TCI6636K2HDAAWA2

Texas Instruments

TCI6636K2HDAAWA2 by Texas Instruments

TCI6636K2HDAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0.95V to 1.05V, has 1517 terminals in a GRID ARRAY package style, and measures 40mm x 40mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,550 parts In-Stock

1+ parts

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3,550

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Vyrian

USA . 3,423 parts In-Stock

1+ parts

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3,423

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 209 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

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209

$15.000

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AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$17.808

100+ parts

-

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520

$17.808

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Corohmni

South Africa . 2,241 parts In-Stock

1+ parts

$58.964

100+ parts

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2,241

$58.964

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Parana Technologies

USA . 428 parts In-Stock

1+ parts

$71.641

100+ parts

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428

$71.641

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DigiPath Technology Company

USA . 2,068 parts In-Stock

1+ parts

$78.885

100+ parts

$72.574

1k+ parts

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10k+ parts

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2,068

$78.885

$72.574

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ChromeModa Solutions

Germany . 1,543 parts In-Stock

1+ parts

$80.495

100+ parts

$66.006

1k+ parts

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10k+ parts

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1,543

$80.495

$66.006

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IDEA Electronic Components Group

UK . 1,388 parts In-Stock

1+ parts

$80.495

100+ parts

$76.470

1k+ parts

$72.446

10k+ parts

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1,388

$80.495

$76.470

$72.446

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Corphita

USA . 1,300 parts In-Stock

1+ parts

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1,300

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Overview

Discover the cutting-edge TCI6636K2HDAAWA2 by Texas Instruments, a high-quality microprocessor circuit that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in the industry, this innovative product is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs. Experience the value and benefits of this advanced technology, providing customers with a competitive edge in their projects. With its superior design and features, the TCI6636K2HDAAWA2 is a game-changer in the world of microprocessor circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between cost and durability, making the product cost-effective and reliable.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.05 V

Can handle higher voltages, providing flexibility in design and operation.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

No. of Terminals: 1517

High number of terminals allow for complex connections and functionality in the product.

Package Style (Meter): GRID ARRAY

Grid array style provides better thermal performance and electrical characteristics.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for energy-efficient operation.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and routing of traces.

Maximum Seated Height: 3.75 mm

Low seated height saves space in the overall product design.

Width: 40 mm

Optimal width for fitting into standard PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process for up to 30 seconds, facilitating manufacturing.

Peak Reflow Temperature °C: 245

Can withstand high reflow temperatures, ensuring reliable solder joints.

Length: 40 mm

Optimal length for fitting into standard PCB layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of microprocessor circuit enhances the product's processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form allows for reliable solder joints and easy rework.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for high density mounting and compact design.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates tolerance to multiple reflows, ensuring robust performance in manufacturing.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6636K2HDAAWA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6636K2HDAAWA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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