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TCI6638K2KDAAW2

Texas Instruments

TCI6638K2KDAAW2 by Texas Instruments

TCI6638K2KDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and has a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,186 parts In-Stock

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3,186

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Digiode

USA . 1,846 parts In-Stock

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1,846

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,175 parts In-Stock

1+ parts

$14.000

100+ parts

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1,175

$14.000

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AZTECH Wire

Italy . 474 parts In-Stock

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$16.253

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474

$16.253

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Corohmni

South Africa . 2,715 parts In-Stock

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$57.174

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2,715

$57.174

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Parana Technologies

USA . 1,972 parts In-Stock

1+ parts

$62.618

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1,972

$62.618

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DigiPath Technology Company

USA . 275 parts In-Stock

1+ parts

$68.950

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275

$68.950

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ChromeModa Solutions

Germany . 5,059 parts In-Stock

1+ parts

$70.357

100+ parts

$57.693

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5,059

$70.357

$57.693

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IDEA Electronic Components Group

UK . 604 parts In-Stock

1+ parts

$70.357

100+ parts

$66.839

1k+ parts

$63.321

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604

$70.357

$66.839

$63.321

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Corphita

USA . 3,380 parts In-Stock

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3,380

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Overview

Unleash the power of cutting-edge technology with the TCI6638K2KDAAW2 by Texas Instruments. Manufactured with precision and expertise, this product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering unmatched quality and reliability. Whether you're looking to enhance your networking systems, telecommunications equipment, or industrial applications, this innovative microprocessor circuit is designed to deliver superior performance and efficiency. Elevate your projects with the value and benefits that this state-of-the-art solution brings to the table. Choose Texas Instruments for excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

High maximum supply voltage allows for flexibility in power input, accommodating a wide range of applications.

Package Shape: SQUARE

Square package shape helps in easy and compact placement of the IC on the PCB, optimizing space utilization.

No. of Terminals: 1517

Large number of terminals provide ample connectivity options for various input and output devices, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and improved thermal performance, contributing to the overall efficiency of the product.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage ensures efficient power consumption, making the product suitable for energy-conscious applications.

Terminal Finish: TIN SILVER COPPER

Triple-terminal finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the product's reliability and performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure PCB mounting, ensuring stable connections and reducing the risk of signal interference.

Maximum Seated Height: 3.75 mm

Low maximum seated height allows for slim and compact design, contributing to space-saving and efficient PCB layout.

Width: 40 mm

Optimal width dimension offers a balanced size for compatibility with standard PCB designs and enclosure requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time at peak reflow temperature ensures proper soldering and component bonding during manufacturing, ensuring product reliability and longevity.

Peak Reflow Temperature °C: 245

High peak reflow temperature allows for efficient soldering and component mounting, ensuring durable and high-quality connections.

Length: 40 mm

Optimal length dimension offers a balanced size for compatibility with standard PCB designs and enclosure requirements.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's processing capabilities, enabling advanced functionality and performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: BALL

Ball terminal form offers reliable and durable connections, reducing the risk of signal loss and ensuring long-term performance.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the product, offering steady performance in various operating conditions.

Terminal Pitch: 1 mm

Standard terminal pitch enables easy and accurate soldering on the PCB, ensuring secure connections and reducing the risk of short circuits.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates low moisture sensitivity, ensuring product reliability and longevity under varying environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6638K2KDAAW2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

TCI6638K2KDAAW2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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