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XC7Z100-1FFG900I

Xilinx

XC7Z100-1FFG900I by Xilinx

The Xilinx XC7Z100-1FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

Median Price

$2,938.190

Lifecycle Status

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Mouser Electronics

USA . 3 parts In-Stock

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Digiode

USA . 174 parts In-Stock

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VNN

France . 936 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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AZTECH Wire

Italy . 540 parts In-Stock

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$8.180

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Corohmni

South Africa . 94 parts In-Stock

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Aztec Data Supply Inc.

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MARBEL Systems

Belgium . 1,058 parts In-Stock

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Texas Native Microelectronics

USA . 25 parts In-Stock

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Kenton Components

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Modulus Dynamics

Lithuania . 1,562 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

USA . 1,453 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Qasali Group International

UK . 1,867 parts In-Stock

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Supply Digital

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Overview

Unlock limitless possibilities with the XC7Z100-1FFG900I by Xilinx. This cutting-edge System on Chip offers unparalleled quality and reliability, backed by a trusted manufacturer known for pushing the boundaries of innovation. With a wide range of applications in Other Function uPs, uCs & Peripheral ICs, this product delivers exceptional value to customers seeking superior performance and efficiency. Experience seamless integration, advanced technology, and unmatched benefits with the XC7Z100-1FFG900I - the ultimate solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 1.05 V

Suitable for low power applications and ensures safe operation within specified voltage limits.

Package Shape: SQUARE

Compact design for efficient use of PCB space.

No. of Terminals: 900

High number of terminals allow for connectivity with multiple components for versatile functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density interconnects for improved performance.

Minimum Supply Voltage: 0.95 V

Allows operation at lower voltage levels for energy-efficient applications.

Maximum Operating Temperature: 100 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Operational at low temperatures for use in extreme conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB assembly and soldering.

Maximum Seated Height: 3.24 mm

Low profile design enables compact and space-saving integration.

Width: 27 mm

Optimal width size for fitting into standard PCB layouts.

Length: 27 mm

Compact length for efficient placement on the PCB.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions on a single chip reduces system complexity and improves performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections for optimal performance.

Nominal Supply Voltage: 1 V

Stable and standard supply voltage for consistent operation.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high density interconnects and compact design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z100-1FFG900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B900

Length:

27 mm

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z100-1FFG900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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