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XC7Z045-2FFG900E

Xilinx

XC7Z045-2FFG900E by Xilinx

The Xilinx XC7Z045-2FFG900E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 900 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

Median Price

$2,823.860

Lifecycle Status

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Mouser Electronics

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Digiode

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AZTECH Wire

Italy . 925 parts In-Stock

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Corohmni

South Africa . 155 parts In-Stock

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Modulus Dynamics

Lithuania . 318 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

UK . 100 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 2 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the XC7Z045-2FFG900E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers superior quality and reliability in their products. This category of Other Function uPs,uCs & Peripheral ICs offers limitless possibilities in various applications. Customers can expect unmatched value, benefits, and advantages when using this product, making it a must-have for those seeking top-notch performance and innovation in their projects. Experience the difference with Xilinx and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring protection for the integrated circuits inside.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, making the product suitable for compact designs.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures safe operation and prevents damage to the integrated circuits.

Package Shape: SQUARE

The square shape provides a uniform and efficient layout when designing circuit boards, optimizing space usage.

No. of Terminals: 900

With a high number of terminals, the product can support complex functionality and connectivity requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and electrical characteristics, enhancing overall product reliability.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures that the product can withstand harsh environmental conditions and maintain performance under stress.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C enables the product to function in cold environments without compromising performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy soldering and connection to circuit boards, streamlining the manufacturing process.

Maximum Seated Height: 3.24 mm

The maximum seated height of 3.24 mm allows for a low-profile design, making the product suitable for slim electronic devices.

Width: 27 mm

The width of 27 mm provides a compact form factor, aiding in space-constrained designs and integration into various electronic systems.

Length: 27 mm

The square shape with a length of 27 mm offers a balanced and symmetrical layout, improving overall aesthetics and functionality.

Peripheral IC Type: SYSTEM ON CHIP

Being a system-on-chip peripheral IC type, the product integrates multiple functions into a single chip, simplifying system design and reducing component count.

Technology: CMOS

The CMOS technology used in the product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BALL

The ball terminal form ensures reliable connections and solder joints, enhancing the overall performance and longevity of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V offers a standard operating range for the product, ensuring compatibility with existing power systems and components.

Terminal Pitch: 1 mm

The 1 mm terminal pitch allows for high-density mounting and compact arrangements of terminals on the product, enabling efficient use of board space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-2FFG900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B900

Length:

27 mm

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-2FFG900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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