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XC7Z045-3FBG676E

Xilinx

XC7Z045-3FBG676E by Xilinx

XC7Z045-3FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has a grid array style and is suitable for various applications requiring high-performance processing capabilities in a compact form factor.

Median Price

$2,302.570

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Semicontronic

India . 1,479 parts In-Stock

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$8.000

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Ampacity Inc.

Singapore . 988 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 250 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 936 parts In-Stock

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Modulus Dynamics

Lithuania . 1,351 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 628 parts In-Stock

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Qasali Group International

UK . 1,487 parts In-Stock

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Argo Parts USA

USA . 2,314 parts In-Stock

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Continental Prestige Electronics

USA . 799 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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MARBEL Systems

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Microchip USA

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Supply Digital

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Corphita

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Netroflash

USA . 100 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XC7Z045-3FBG676E by Xilinx. Renowned for their superior quality and innovative solutions, Xilinx has created a versatile product that belongs to the category of Other Function uPs,uCs & Peripheral ICs. This product offers unmatched value and benefits, making it ideal for a wide range of applications. Experience seamless performance, reliability, and efficiency with the XC7Z045-3FBG676E, setting new standards in the industry. Elevate your projects and achieve unparalleled success with this exceptional offering from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making it a good choice for a wide range of applications.

Surface Mount: YES

This feature allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage, this product can handle power fluctuations without risking damage to the components.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a circuit board, making it suitable for compact designs.

No. of Terminals: 676

With a high number of terminals, this product can support complex functionalities and connectivity options.

Package Style (Meter): GRID ARRAY

The grid array package style provides a stable and reliable connection between the components, enhancing overall performance.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures that the product can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand heat and perform reliably in challenging environments.

Minimum Operating Temperature: 0 °C

The ability to operate at freezing temperatures makes this product suitable for a wide range of applications, including outdoor or industrial settings.

Terminal Position: BOTTOM

The terminal position at the bottom of the package allows for easy integration into existing circuit designs and facilitates efficient heat dissipation.

Maximum Seated Height: 2.54 mm

The low maximum seated height makes this product suitable for compact devices where space is limited.

Width: 27 mm

The moderate width of this product allows for easy integration into standard circuit board sizes.

Length: 27 mm

The moderate length of this product ensures compatibility with a wide range of circuit board layouts.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single package, reducing the need for additional components and simplifying circuit designs.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

The ball terminal form provides a reliable connection and simplifies the assembly process, ensuring a secure and stable electrical connection.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V optimizes power efficiency and performance, making this product ideal for energy-conscious applications.

Terminal Pitch: 1 mm

The small terminal pitch allows for a high density of terminals, enabling complex functionalities and connectivity options in a compact package.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-3FBG676E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-3FBG676E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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